EDGE PC TANK-XM810 series

Edge AIAI Inferenceembedded

Overview
The TANK-XM810 is a fanless rugged embedded system for modular Edge AI inference and industrial applications. It supports 10th/11th Gen Intel® Core™ processors, modular eChassis and optional eBP backplanes for GPU and accelerator expansion, and is engineered for operation in harsh environments (surveillance, transportation, machine vision, advanced manufacturing).

Key features

• Fanless pin-fin heatsink thermal design with optional external fan kit for sustained high-TDP operation
• Modular expansion via IEI eChassis and optional eBP backplanes (multiple TXC/TXCBP variants)
• Dual-power input support for host and high-power accelerator cards (12–28 V DC host; 12 V or 16–28 V DC for accelerators)
• Onboard 2 x 2.5GbE and optional PoE/LAN modules; multiple USB, serial and display outputs; TPM/Intel PTT support
• Wide operating temperature range and rugged shock/vibration specifications

Supported CPUs

• Intel® Core™ i3-10100TE (2.3 GHz, up to 3.6 GHz, 35W)
• Intel® Core™ i3-10320 (3.8 GHz, up to 4.6 GHz, 65W)
• Intel® Core™ i5-10500 (3.1 GHz, up to 4.5 GHz, 65W)
• Intel® Core™ i5-10500TE (2.3 GHz, up to 3.7 GHz, 35W)
• Intel® Core™ i7-10700E (2.9 GHz, up to 4.5 GHz, 65W)
• Intel® Core™ i7-10700TE (2.0 GHz, up to 4.4 GHz, 35W)

Expansion & Acceleration

• Supports GPU eChassis (TXC-XM81-G1 / G2) and multiple TXCBP-XM81 backplanes for flexible PCIe/PCI slot configurations
• Can host GPUs, frame grabbers, Intel Movidius/Google Coral accelerators, FPGAs, I/O cards and high-speed NICs
• Optional power board (e.g., IDD-X1228150) and dual-power inputs provide required power for high-draw add-on cards

Applications

• Edge AI inference, machine vision and intelligent manufacturing
• Digital surveillance and camera systems (PoE option)
• Transportation systems, mobile/vehicle deployments and industrial automation

Technical specifications

• Model: TANK-XM810
• Chipset: Q470 / Q470E
• Memory: 2 x SO-DIMM DDR4-2933 MHz, up to 64 GB
• Storage: 1 x 2.5" SATA bay; 2 x M.2 2280 M-key (PCIe x2, RAID 0/1 support)
• I/O: 6 x USB 3.2 Gen2, 2 x USB 2.0; 1 x HDMI™ 1.4, 1 x DP++; 2 x RJ-45 2.5GbE; COM: 2 x RS-232/422/485 + 4 x RS-232; DIO: 12-bit (6-in/6-out)
• Power input: DC Jack / Terminal Block 12 V ~ 28 V DC; example consumption: 12V @ 8A
• Cooling: Fanless with 4-pin external system fan connector (optional fan kit for 65W CPUs)
• Dimensions: 230.6 x 256.04 x 76.2 mm; Weight: ≈ 3.2 / 3.5 kg (depends on config)
• Operating temp: -20°C ~ 60°C (depending on CPU TDP and airflow); Humidity: 10% ~ 95% non‑condensing
• Shock & vibration: Half-sine 5G, MIL-STD-810G notes (SSD)
• Compliance: CE / FCC; OS: Windows 10 / 11, Linux