Box PC TANK-XM812 series

embeddedAMD Ryzen™RS-232

Overview

• High-Performance AMD Ryzen™ 7000/8000 Series AM5 Processor, fanless embedded computer designed for rugged applications.
• Supported CPUs include AMD Ryzen™ 7 8700G (4.2 GHz, up to 5.1 GHz, 8-core, 65W) and AMD Ryzen™ 5 8600G (4.3 GHz, up to 5.0 GHz, 6-core, 65W).
• AMD B650 chipset. 2 x SO-DIMM DDR5 5200 (8GB pre-installed, up to 96GB).
• 2 x 2.5GbE ports, multiple USB and serial ports, digital I/O and multiple internal expansion options.
• Optional backplanes and chassis available. CE/FCC compliant.

Product summary
High-Performance AMD Ryzen™ 7000/8000 Series AM5 Processor, Fanless Embedded Computer

Hardware Specifications
Form factor

• CPU: AMD Ryzen™ 7000/8000 Series AM5 Processor; AMD Ryzen™ 7 8700G (4.2 GHz, up to 5.1 GHz, 8-core, 65W); AMD Ryzen™ 5 8600G (4.3 GHz, up to 5.0 GHz, 6-core, 65W)
• Chipset: AMD B650
• System Memory: 2 x SO-DIMM DDR5 5200 (8GB pre-installed) (up to 96GB)
• Power: DC Jack 12 V ~ 28 V DC; Terminal Block 12 V ~ 28 V DC; Consumption: 12V @ 6.95A (AMD Ryzen™ 7 8700G with 8GB memory)

I/O Interface

• USB: 6 x USB 3.2 Gen2
• Ethernet: 2 x RJ-45: 2.5 GbE (Intel® I226V)
• COM Port: 2 x RS-232/422/485; 4 x RS-232
• Digital I/O: 12-bit Digital I/O (6-in / 6-out)
• Display: 1 x HDMI; 1 x DP++; 2 x USB Type-C (Display + USB 3.2 Gen2)
• Audio: 1 x Mic; 1 x Line-out
• TPM: 1 x 20pin TPM connector (Optional TPM-IN03 module)
• Watchdog Timer: Programmable 1 ~ 255 sec/min

Expansion Slots

• M.2: 1 x 2280 M-key (PCIe Gen4 x4); 1 x 2230 A-key (USB 2.0 + PCIe Gen3 x1)
• Backplane: Optional

System

• Cooling method / System Fan: Fanless; 4-pin external system fan connector
• Drive Bays: 2 x 2.5” SATA 6Gb/s HDD/SSD bay (RAID 0/1 supported)

Indicator & Buttons

• Buttons: 1 x Power button; 1 x Reset button; 1 x AT/ATX switch
• Indicators: 1 x Power LED (green); 1 x HDD LED (yellow)

Physical Characteristics
Construction: Extruded aluminum alloy

Color
Black

Dimensions
230.6 x 255 x 68.7 (mm)

Weight
3.18 / 5 kg

Environment

• Operating Temperature: -20°C ~ 60°C (CPU TDP50W & SSD); -20°C ~ 50°C (CPU TDP65W & SSD)
• Humidity: 10% ~ 95% non-condensing
• Operating Vibration: IEC68-2-27 half-sine, 5G, 11ms, 100 shocks (With SSD)
• Operating Shock: Random Vibration Mode, MIL-STD-810H 514.8C-I (With SSD)
• Safety & EMC: CE / FCC compliant

OS Compatible
Microsoft Windows 10 / Windows 11, Linux

Ordering Information

• TANK-XM812-87AC-R10: Ruggedized fanless embedded system with AMD Ryzen™ 7 8700G, 8GB DDR5 pre-installed memory, PCIe x8/PCIe x4/PCIe x1, HDMI/DP/USB4, 12~28V DC, RoHS
• TANK-XM812-85AC-R10: Ruggedized fanless embedded system with AMD Ryzen™ 5 8600G, 8GB DDR5 pre-installed memory, PCIe x8/PCIe x4/PCIe x1, HDMI/DP/USB4, 12~28V DC, RoHS

Package Contents

• 1 x Wall mounting kit
• 1 x Screw pack
• 2 x Terminal block
• 1 x SATA cable

Caractéristiques / spécifications techniques

• CPU support: AMD Ryzen™ 7000/8000 Series AM5 (examples: Ryzen™ 7 8700G, Ryzen™ 5 8600G)
• Chipset: AMD B650
• Memory: 2 x SO-DIMM DDR5 5200 (8GB pre-installed, up to 96GB)
• LAN: 2 x 2.5 GbE (Intel®)
• USB: 6 x USB 3.2 Gen2, plus 2 x USB Type-C (Display + USB)
• Serial: 2 x RS-232/422/485, 4 x RS-232
• Storage: 1 x M.2 2280 (PCIe Gen4 x4), M.2 2230 A-key (PCIe Gen3 x1 + USB2.0), 2 x 2.5” SATA bays (RAID 0/1)
• Fanless design with optional external system fan connector
• Operating temp: -20°C to 60°C (depending on CPU TDP)
• Construction: Extruded aluminum alloy; Color: Black; Dimensions: 230.6 x 255 x 68.7 mm