EDGE PC DRPC-240-TGL-U series

embeddedDIN railIntel® Core™ i7-1185G7E

Overview
The DRPC-240-TGL-U is a fanless DIN-rail embedded system built for space-constrained industrial edge deployments. It integrates 11th Gen Intel® Core mobile processors (Tiger Lake), ships with 8 GB DDR4 pre-installed, and supports modular expansion via a PCIe x4 backplane for AI accelerators or I/O cards.

Key features

• Supported CPUs: Intel® Celeron® 6305 / 6305E; Intel® Core™ i5-1145G7E; Intel® Core™ i7-1185G7E (up to 4 cores, 15W TDP)
• Fanless thermal design with pin‑fin heatsink; optional external fan kit (P/N SF-DRPC-240-R10) for higher sustained TDP
• Networking: 4 × 2.5GbE RJ-45 ports (optional PoE via GPOE-DRPC-240 / GPOE-2P), total PoE budget up to 60 W with PoE module
• Industrial serial: 2 × RS-232 and 2 × RS-422/485 (DB-9) with 2.5 kV isolation; RS-422/485 supports Automatic Flow Control (AFC)
• Dual 4K display outputs: 1 × HDMI (up to 3840×2160@30Hz) and 1 × DP++ (up to 4096×2304@60Hz)

Expansion & Connectivity

• PCIe x4 backplane (optional expansion chassis) for AI accelerators, vision or I/O cards
• M.2 slots: 1 × 2230 A-key (PCIe Gen3 x1 / USB2.0) for Wi‑Fi/BT; 1 × 3042/3052/3080 B-key for LTE/AI accelerator (on-board SIM socket for B-key)
• USB: 2 × USB 3.2 Gen2, 2 × USB 2.0
• Storage: 1 × 2.5" SATA 6Gb/s HDD/SSD bay; M.2 for NVMe/expanders as supported

Applications

• Factory automation, production line monitoring and control
• AI inference and machine vision at the edge (with Mustang/Movidius accelerators)
• Warehouse management, transportation gateways and rugged IoT/OT deployments
• Smart building automation and remote telemetry

Technical specifications

• Model: DRPC-240-TGL-U
• CPU options: Intel® Celeron® 6305E; Intel® Core™ i5-1145G7E; Intel® Core™ i7-1185G7E
• Memory: 2 × SO‑DIMM DDR4 3200 MHz (8 GB pre-installed, up to 64 GB)
• Ethernet: 4 × RJ-45 2.5GbE
• Serial I/O: 2 × RS-232, 2 × RS-422/485 (DB-9, 2.5 kV isolation)
• M.2: 1 × 2230 A-key, 1 × 3042/52/80 B-key (SIM socket onboard)
• Expansion: optional PCIe x4 backplane (stack expansion chassis)
• Power input: Terminal block 12 ~ 28 V DC; remote power on/off supported
• Dimensions (W×D×H): 150 × 190 × 81 mm; Weight: ≈2.15–2.5 kg
• Operating temp.: -20°C ~ 60°C (depends on configuration and airflow)
• Compliance: CE / FCC; OS: Windows 10 / 11, Linux
• Package contents: DIN‑rail mounting kit, screw pack, terminal block