EDGE PC DRPC-242-ADL-P series

Edge AIAI Inferencebox

Overview
The DRPC-242-ADL-P is a fanless, DIN-rail mountable box PC with a stackable modular PCIe x4 expansion architecture, designed for industrial edge and IIoT applications including AMR controllers, EV charging control, robotics and cabinet automation. It supports 13th/12th generation Intel® Core™ mobile processors and offers flexible I/O, wireless and storage options for edge deployments.

Key Features

• Supported CPUs: Intel® Core™ i7-1370PE, i7-1260P, i5-1340PE, i3-1320PE (mobile P-series up to 28W TDP)
• Fanless pin-fin heatsink design for improved 2D heat conduction and reduced flow impedance
• Wide operating temperature range: -20°C to 60°C (depends on configuration and cooling)
• Stackable modular PCIe Gen3 x4 expansion (optional TXC-DRPC-242-1S chassis) for I/O, vision, motion or AI cards
• AI support: Intel® DL Boost and Intel® Distribution of OpenVINO™ for inference acceleration

Expansion & Storage

• 1 x M.2 2230 A-key (PCIe Gen3 x1 / USB 2.0) for Wi‑Fi/Bluetooth
• 1 x M.2 3042/3052 B-key (PCIe Gen3 x1 / USB 3.2 Gen2 / USB 2.0) for 4G/5G modules with onboard hinge SIM socket
• 1 x M.2 2280 M-key (PCIe Gen4 x4) for NVMe SSD
• 1 x 2.5" SATA 6Gb/s bay (supports dual-storage: M.2 NVMe + 2.5" SSD)
• Optional PCIe Gen3 x4 backplane via expansion chassis

Industrial I/O & Connectivity

• USB: 2 x USB 3.2 Gen2, 4 x USB 2.0
• Ethernet: 3 x 2.5 GbE (Intel® I226 family)
• Display: 1 x lockable HDMI 1.4b (up to 4096 x 2160@30Hz), 1 x DP 1.4b (up to 4096 x 2160@60Hz, DP++ passive HDMI adapter supported)
• COM: 2 x RS-232 + 2 x RS-422/485 with 2.5kV isolation (DB9)
• GPIO: optional 12-bit (6-in, 6-out)
• Wireless & cellular: M.2 A-key for Wi‑Fi/Bluetooth, M.2 B-key for 4G/5G, onboard SIM; external fan connector for optional active cooling

Reliability & Industrial Design

• Chassis: extruded aluminum alloy, black finish
• Power input: wide-range 12 ~ 28 VDC via 3-pin terminal block; AT/ATX modes; remote power support
• Ruggedness: non-operation shock 15G, operation shock 5G (model-dependent); operating vibration and shock ratings for SSD-equipped systems
• Certifications: CE, FCC, UKCA; TPM support via Intel® PTT

Performance & Cooling Options

• Optimized passive thermal design for fanless operation; optional external fan kit (SF-DRPC-240) for higher sustained TDP
• Performance modes: typical 15W TDP (fanless) and up to 28W with external fan kit for intensive workloads

Multimedia & Graphics

• Integrated SoC graphics (up to 96 EU depending on CPU) for machine vision and AI preprocessing
• Dual 4K display support via HDMI + DP for operator panels and HMI

Ordering & Package Highlights
Example SKUs: DRPC-242-ADL-P-Ri7ECS-R11 (13th Gen i7, 8GB pre-installed), DRPC-242-ADL-P-Ri5ECS-R11 (13th Gen i5, 8GB). Package typically includes DIN-rail mounting kit, screw pack and terminal block.

Technical specifications

• Form factor / Chipset: SoC; DIN-rail embedded box PC
• Memory: 2 x SO-DIMM DDR4 3200 MHz (8 GB pre-installed, up to 64 GB)
• Power example: 12V @ 4.46A (i7-1260P with DDR4 8 GB)
• I/O summary: 2 x USB 3.2 Gen2; 4 x USB 2.0; 3 x 2.5 GbE; 1 x lockable HDMI 1.4b; 1 x DP 1.4b; 4 x COM (2 x RS-232 + 2 x RS-422/485, 2.5kV isolation)
• Expansion: M.2 2230 A-key, M.2 3042/3052 B-key (with SIM), M.2 2280 M-key (PCIe Gen4 x4); optional PCIe Gen3 x4 backplane
• Drives: 1 x 2.5" SATA 6Gb/s bay; M.2 NVMe support
• Cooling: fanless; 4-pin external system fan connector
• Dimensions: 81 x 150 x 190 mm; Weight: ~1.88 / 2.66 kg (config-dependent)
• Environment: Operating -20°C ~ 60°C (with specified airflow for SSD); Humidity 10% ~ 95% non-condensing
• Shock & Vibration: operating shock 5G, non-operation 15G; vibration 10-500 Hz, 1.04 Grms (SSD)
• OS: Microsoft® Windows® 10/11, Linux