EDGE PC TANK-XM811 series

Edge AIboxdesktop

Overview
IEI TANK-XM811 is a fanless embedded computer designed for rugged edge deployments requiring high CPU/GPU throughput, low-latency NVMe storage and modular expansion. It supports 12th/13th/14th Gen Intel® Core™ processors and scalable GPU/accelerator connectivity via IEI eChassis and optional backplanes. Typical use cases include edge AI inference, surveillance, transportation systems and advanced manufacturing.

Key Features

• CPU support: 12th/13th/14th Gen Intel® Core™ (examples: i5-12500TE, i7-12700TE, i9-12900TE) — 35W standard, up to 65W with configured cooling.
• Chipset: Intel R680E.
• Fanless pin-fin heatsink design; optional external fan kit for high-TDP configurations.
• Onboard networking: 2 x 2.5GbE; optional PoE LAN modules available.
• High-speed I/O: up to 8 x USB 3.2 Gen2, HDMI and DP++ for dual 4K displays, multiple serial ports and 12-bit DIO.

Expansion & Acceleration

• Modular expansion via IEI eChassis (e.g., TXC-XM81-G1 / TXC-XM81-G2) and optional backplanes (TXCBP-XM81 series) to support GPUs, VPUs, FPGAs and multiple PCIe add-in cards.
• Supports accelerator cards (Intel® Movidius™, Google Coral, Mustang series, FPGA cards) depending on selected eChassis/backplane.
• Dual-power input and optional power board (e.g., IDD-X1228150) for powering high-draw acceleration cards.

Connectivity & I/O

• Ethernet: 2 x 2.5GbE onboard (Intel® I226V / I226LM variants).
• Optional PoE module: up to 8 x 2.5GbE PoE+ (GPOE-XM81-8P).
• USB: 8 x USB 3.2 Gen2.
• Display: 1 x HDMI™, 1 x DP++ (dual independent 4K capable).
• Serial: 2 x RS-232/422/485, 4 x RS-232.
• DIO: 12-bit (6-in / 6-out).
• Storage expansion: M.2 2280 M-key (PCIe x4 NVMe), M.2 2230 A-key (WiFi/BT), additional M.2 B-key options for LTE/5G or accelerators.

Thermal, Ruggedness & Power

• Fanless design with pin-fin heatsink for passive cooling and vibration resilience; external fan option for sustained high-TDP operation.
• Operating temperature examples: -20°C to 60°C (with airflow for TDP 35W), -20°C to 50°C (with airflow for TDP 65W) — depends on configuration.
• Shock & vibration: half-sine shock 5G 11 ms; SSD-related MIL-STD-810G vibration specs.
• Power input: DC jack or terminal block 12–28 V DC; dual-power support for acceleration cards.

Storage & Drive Bays

• 1 x M.2 2280 M-key (PCIe x4 NVMe) for high-performance storage.
• 1 x 2.5" SATA 6 Gb/s bay for HDD/SSD.

Design & Installation

• Extruded aluminum alloy chassis, black finish.
• Mounting options: wall-mount, side-mount (cabinet), desktop.
• Compact dimensions: 230.6 x 256.04 x 76.2 mm; weight ~3.33–3.7 kg depending on configuration.

Compliance & Software

• Certifications: CE / FCC compliant.
• OS support: Microsoft Windows 10 / Windows 11 and Linux.
• Security: Intel® Platform Trust Technology (Intel® PTT) support.

Ordering & Package

• Typical SKUs: TANK-XM811-i9AD-R11, TANK-XM811-i7AC-R11, TANK-XM811-i5AC-R11 (variations by CPU/memory/configuration).
• Package examples: wall mounting kit, screw pack, terminal blocks; optional fan kit, eChassis and backplanes sold separately.

Technical specifications

• Model: TANK-XM811
• CPU: 12th/13th/14th Gen Intel® Core™ (35W standard; up to 65W with configured cooling)
• Chipset: Intel R680E
• Memory: 2 x SO-DIMM DDR4-3200 (8GB pre-installed optional, up to 64GB)
• Storage: 1 x M.2 2280 M-key (PCIe x4 NVMe), 1 x 2.5" SATA bay
• I/O: 8 x USB 3.2 Gen2; 2 x 2.5GbE; multiple COM ports; 12-bit DIO
• Display: 1 x HDMI™, 1 x DP++ (dual independent display, 4K)
• Expansion: eChassis / backplane support for GPUs and PCIe add-in cards
• Power input: 12–28 V DC (DC jack or terminal block); dual-power support
• Cooling: Fanless pin-fin heatsink; 4-pin external fan connector
• Dimensions: 230.6 x 256.04 x 76.2 mm; Weight: ~3.33–3.7 kg
• Operating temp.: -20°C ~ 60°C (config dependent)
• Certifications: CE / FCC