EDGE PC TANK-XM813 series

Edge AIAIAI Inference

Overview
The IEI TANK‑XM813 is a fanless edge AI embedded computer designed for industrial edge intelligence. It supports 2nd‑series Intel® Core™ Ultra (Arrow Lake‑S) processors in an LGA1851 socket (up to 65 W TDP), integrated NPU (Intel® AI Boost) and optional Intel® Arc™ graphics on select SKUs. Its modular three‑layer architecture enables scalable GPU expansion, multiple backplane and chassis options, and flexible I/O for machine vision, transportation, medical imaging and factory automation workloads.

Key Features

• LGA1851 socket supporting Intel® Core™ Ultra Processors (Series 2) — up to 65W TDP
• Built‑in NPU (Intel® AI Boost) for AI inference; optional Intel® Arc™ graphics on supported SKUs
• High‑speed DDR5 memory: 2 x SO‑DIMM DDR5‑5600 (up to 96 GB; 16 GB pre‑installed)
• Support for full‑length 3‑slot GPU cards via optional eChassis (scalable GPU expansion)
• Dual 2.5GbE LAN (Intel® I226 family), multiple USB and serial ports
• Fanless extruded‑aluminum chassis with multi‑layer heat spreader; optional external fan kit for sustained 65W CPU operation
• Modular options: 2/4/6‑slot backplanes and expansion chassis, PoE modules, IO boards and power modules

Modular Expansion & I/O Highlights

• M.2 2280 M‑Key: PCIe Gen4 x4 NVMe for high‑bandwidth storage
• M.2 2230 A‑Key: USB + PCIe x1 for Wi‑Fi/BT modules (vPro support where applicable)
• Optional backplanes/eChassis (TXCBP / TXC‑XM81 series) supporting various PCIe/PCI slot mappings (2/4/6 slots)
• Optional internal boards: PoE LAN card (GPOE‑XM81‑8P), IO expansion, TPM, wireless kits, fan kits, power boards

I/O Summary

• USB: up to 7 x USB 3.2 Gen2 (system I/O as configured)
• Ethernet: 2 x 2.5 GbE (Intel® I226LM / I226‑V)
• COM: 2 x RS‑232/422/485 and 4 x RS‑232
• Digital I/O: 12‑bit (6‑in / 6‑out)
• Display: 1 x HDMI, 1 x DP++, 1 x USB4 (Display + USB 3.2 Gen2x2)
• Audio: Mic and Line‑out
• TPM: Intel PTT support and 2 x 10‑pin TPM connector
• Watchdog: programmable 1 ~ 255 sec/min

Thermal, Power & Mechanical

• Cooling: fanless with 4‑pin external system fan connector; optional external fan kit (SF‑TANK‑XM81) for sustained 65W CPU performance
• Drive bays: 2 x 2.5" SATA 6 Gb/s HDD/SSD (RAID 0/1 supported)
• Power input: DC jack or terminal block 12–28 V DC; dual‑power support for GPU/accelerators via IEI power board (IDD‑X1228150‑R10)
• Chassis: extruded aluminum alloy (black)
• Dimensions: 230.6 x 255 x 68.7 mm; Weight: 3.2–3.6 kg (depending on configuration)

Environment & Compliance

• Operating temperature: -20°C ~ 60°C (TDP 35W & SSD); -20°C ~ 50°C (TDP 65W & SSD) depending on cooling
• Humidity: 10% ~ 95% non‑condensing
• Shock & vibration: Half‑sine shock 5G, 11 ms, 100 shocks/axis (SSD); MIL‑STD‑810G 514.6C‑1 (SSD)
• Safety & EMC: CE / FCC compliant

Package & Ordering Notes

• Typical package: wall mounting kit, screw pack, 2 x terminal block (contents may vary by SKU)
• Ordering examples: TANK‑XM813‑U9BD‑R10 (Ultra 9 285, 65W), TANK‑XM813‑U9AD‑R10 (Ultra 9 285T, 35W), TANK‑XM813‑U7BD‑R10, etc.

Specifications

• CPU: LGA1851 socket, Intel® Core™ Ultra Processors (Series 2), up to 65W TDP
• Chipset: W880
• Memory: 2 x SO‑DIMM DDR5‑5600 (16 GB pre‑installed, up to 96 GB)
• Storage: 1 x M.2 2280 M‑Key (PCIe Gen4 x4 NVMe); 2 x 2.5" SATA bays (RAID 0/1)
• I/O: up to 7 x USB 3.2 Gen2; 2 x 2.5GbE; serial ports; 12‑bit digital I/O; HDMI, DP++, USB4
• Expansion: optional backplanes/eChassis (2/4/6 slots) for GPU, PCIe cards, PoE modules
• Power: 12–28 V DC input; dual‑power support for high‑power add‑on cards
• Dimensions / Weight: 230.6 x 255 x 68.7 mm / 3.2–3.6 kg
• Compliance: CE, FCC