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Semiconductor test platform

Semiconductor test platform - Xiamen Dexing Magnet Tech. Co., Ltd.
Semiconductor test platform - Xiamen Dexing Magnet Tech. Co., Ltd.
Semiconductor test platform - Xiamen Dexing Magnet Tech. Co., Ltd. - image - 2
Semiconductor test platform - Xiamen Dexing Magnet Tech. Co., Ltd. - image - 3
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Characteristics

Other characteristics
for semiconductors

Description

This Electrical Properties Measurement System is an integrated, modular test platform for electrical characterization of functional materials (ferroelectric, piezoelectric, pyroelectric, dielectric, insulation, conductive) under controlled high and low temperature conditions. The system supports interface compatibility with standard electrical test instruments for straightforward hardware and software expansion and integration.

System configuration (components and roles)
  • Ferroelectric Analyzer: ferroelectric parameter analyzer, high-voltage amplifier, test fixtures, system controller and displacement sensor; combined with temperature stages enables ferroelectric, piezoelectric, pyroelectric tests, thermally stimulated depolarization current (TSDC) and related measurements.
  • High-voltage amplifier: provides the required high-voltage drive for polarization and high-field testing.
  • Various test fixtures: mechanical and electrical fixtures adapted to different sample geometries and measurement types.
  • High and low temperature environment chamber: implemented as hot/cold stages, temperature chambers or near-infrared high-temperature furnaces for temperature-dependent measurements.
  • Dielectric temperature spectrum test (with impedance analyzer): broadband impedance/admittance/reactance/conductance/inductance, dielectric loss and quality factor measurements vs. frequency and temperature; supports Curie temperature testing.
  • Insulation resistance test (high-resistance meter): precision voltage output and current measurement for high-temperature insulation resistance, resistivity and resistance spectrum of ceramics, silicone, PCB, mica, PTFE and similar materials.
  • Low resistance tester: low-resistance measurements and resistance spectrum across temperature when combined with environmental chambers or furnaces.
  • Four-probe test (source meter): high-temperature four-probe measurements for conductors and semiconductors; supports temperature-controlled conductivity testing.
  • Seebeck coefficient / resistance measurement system: infrared high-temperature furnace + source meter + controller for thermoelectric measurements (Seebeck coefficient and resistance) across temperature ranges; thin-film options available.
  • System controller: temperature control of stages/furnaces, acquisition of voltage/current/switch/displacement signals, automation and data logging.
  • High-voltage polarization power supply: for polarization, breakdown and flash tests of piezoelectric ceramics and films.
  • Mechanical in-situ loading device: enables in-situ mechanical loading and parameter testing for piezoelectric ceramics.


Extensible test device
  • The system architecture and interfaces are designed for extensibility and compatibility with additional instruments and modules to meet custom test requirements.


Test modules and functions
  • 01. Ferroelectric parameter tests: dynamic/static hysteresis, PUND, fatigue, retention, imprint, leakage current and thermal measurements.
  • 02. Insulation resistance: precision high-voltage output and current measurement for high-temperature insulation and resistivity testing.
  • 03. Piezoelectric parameters: static d33 and other parameters; dynamic piezoelectric coefficient measurement with displacement sensor and high-voltage excitation.
  • 04. High-temperature four-probe: dual-mode straight or square four-probe testing for conductor and semiconductor characterization across temperatures, compliant with relevant standards.
  • 05. Pyroelectric tests: temperature-dependent pyroelectric measurements for thin-film and bulk materials (pyroelectric current, coefficient, residual polarization vs. temperature/time). Temperature ranges: thin films -196℃ to +600℃; bulk options: room temp to 200℃, to 600℃, to 800℃.
  • 06. Dielectric temperature spectrum: analysis of Z, X, Y, G, B, L, dielectric loss D and quality factor Q vs. broadband frequency and temperature; supports Curie point analysis.
  • 07. Seebeck coefficient / resistance: thermoelectric property evaluation for semiconductors, ceramics and metals; thin-film options; low-temperature range -100℃ to 200℃; high-resistance option up to 10 MΩ.
  • 08. Electrocaloric effect testing: electrocaloric performance across wide temperature range. Temperature range -50℃ to 200℃; heat flow timing 1 s to 1000 s; maximum voltage up to 10 kV; waveform support: user-defined, pulse, triangle, sine, arbitrary, predefined.
  • 09. Thermally stimulated depolarization current (TSDC): study of molecular relaxation, phase transitions, glass transition, relaxation times and activation energies of dielectric properties.


Technical features / specifications
  • Modularity: instrument-level modular components (ferroelectric analyzer, impedance analyzer, temperature chambers, source meters, HV amplifiers, high-resistance meters, four-probe systems).
  • Temperature capabilities: configurations supporting cryogenic/low temperatures (e.g., -196℃ thin-film) up to high temperatures (near-infrared furnaces, bulk pyroelectric tests up to 800℃).
  • Maximum test voltage: up to 10 kV (electrocaloric / HV polarization).
  • Heat flow timing (electrocaloric): 1 s to 1000 s.
  • Dielectric analysis: impedance/admittance/reactance/conductance/susceptance/inductance, dielectric loss (D) and quality factor (Q) across broad frequency and temperature ranges.
  • High-resistance measurement: option up to 10 MΩ (configurable).
  • Four-probe conductivity: dual-mode straight or square probe measurement compliant with relevant standards.
  • Waveform generation: supports user-defined, pulse, triangle, sine, arbitrary and predefined waveforms.
  • Data & integration: adaptive communication interfaces and database processing for software compatibility and future expandability.

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