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... helps to place the SMDs accurately. When the pipette comes into contact with the components, the vacuum automatically switches itself on and when placing them, it switches off. The specialised vision system allows the optimal placement ...
FRITSCH
... The placeALL®520 is a modular Pick& Place system and especially useful to build prototypes and small series. It supports a large range of components (chips, FP-components and BGAs), so even the most complex ...
FRITSCH
... pitch of 0.3 mm and BGAs, even complex tasks can be flexibly assembled. With a maximum of 208 possible feeder positions and a intelligent software, changeover times can be reduced to a minimum. Additionally the placeALL® machines ...
FRITSCH
... to Fine Pitch 70 × 70 mm and pitch 0.3 mm, BGAs, µBGAs, CSPs, QFNs and custom parts like connectors, wired THT-LEDs etc. With this system components up to 70 × 70 mm including pins (FP) and balls of BGAs can be measured ...
FRITSCH
... the pickup to the placement step. The laser centering can handle components from 0402 chips up to 22 × 22 mm (optional 32 x 32 mm) in size and 0.6 mm in pitch. With this system components up to 70 × 70 mm including pins (FP) and ...
FRITSCH
... systems for component placing. The LM901 supports the whole dispensing-/ Pick& Place - process, from supplying the solder paste or glue to placing standard, Fine-Pitch or BGA components. The universal ...
FRITSCH