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... deactivates on placement. A specialised vision system enables optimal placement of
BGA and QFN packages. Supported component range: from Chip 0201 to Fine-Pitch and
BGA.
Technical specifications
- Max.
FRITSCH
... Product information
The placeALL®520 is a modular
Pick&
Place system for prototyping and small-series production. It handles a wide range of components (chips, fine-pitch components and
BGAs). Intelligent ...
FRITSCH
... Information
The placeALL®620 is a modular
pick-and-
place
machine designed for small to medium series production. It handles a wide component spectrum from 0201 chips up to 70×70 mm fine-pitch parts ...
FRITSCH
... area than the placeALL®620. It handles a wide component range from 0201 chips up to fine-pitch parts with 0.3 mm pitch and BGAs, enabling flexible assembly of complex projects. With up to 284 feeder positions (configurable) and intelligent ...
FRITSCH
... the placeALL® series. Its dimensions accommodate large PCB projects while leaving room for multiple trays and feeders. The machine can be configured with up to 346 feeding positions; when an inline system is integrated in the front area, ...
FRITSCH
... model of our modular pick-and- place systems. In addition to LM900 functionality, it can be extended with axis brakes, dispensers and optical support systems for component placement. It supports the complete dispensing ...
FRITSCH
... placement workflow, from solder-paste or adhesive application to placement of chip, fine-pitch and special components. The machine keeps the same placement throughput as the LM901 while accommodating larger PCBs and an increased placement ...
FRITSCH