Fujifilm polymer resins

Materials for positive dry and immersion imaging, and negative tone development (NTD) Wide array of high resolution imaging systems for 193 nm exposure including positive dry and immersion imaging and negative tone development (NTD) • ...

GKR series are positive tone KrF photoresist systems that cover a wide range of applications. • Non PFOS/PFAS materials • High aspect ratio application • Superior resistance to plasma etching & ion implantation • Wide process windows • ...

Extensive series of mid-uv sensitive photoresists for critical to non-critical applications encompassing sub-0.30µm to >1.0µm resolution on varied substrates over a large range of resist thickness. Product Summary • Advanced i-Line ...

Multiple series of negative tone, polyisoprene-based resist systems applicable to a broad range projection, proximity and contact imaging and wet etch needs on varied substrates Product Summary • SC Resist series Designed for thicker ...

Positive and negative tone resist series for a wide array of e-beam imaging applications • Superior resolution • Wide process windows Product Summary FEP series • The FEP series of products are suited to work with a wide array ...

Fujifilm's chemically amplified PBO products offer high reliability with low cost of ownership. • High contrast, positive acting materials based on PBO chemistry • Photo-imageable using g-line, i-line or broadband exposure tools • ...

Fujifilm’s solvent developable polyimides are a family of photo-imageable polyimide precursors, covering both high and low cure temperatures for edistribution layer (RDL) and buffer coat applications. • Negative acting, solvent developable ...

Fujifilm has several non-photosensitive polyimide formulations for a wide variety of semiconductor and related applications. • Final coating thicknesses from 400 Angstroms to 25 microns • Low temperature cure options • Very low shrinkage • ...