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... The 3935 and 3920 EP broadband plasma defect inspection systems support wafer-level defect discovery, yield learning and inline monitoring for ≤5nm logic and leading-edge memory design nodes. With a light source that ...
KLA Corporation
... frontside, backside and edges for multiple
wafer sizes and substrate types.
Product Series and Summaries
- 39xx Series: Super-resolution broadband plasma patterned wafer inspection
KLA Corporation
... noise sensor to capture critical defects across a range of process layers and device types. NanoPoint™ technology focuses inspection on pattern areas at high risk for reliability failures, delivering actionable defect data that helps ...
KLA Corporation
... advanced DRAM and 3D NAND memory devices. Part of a portfolio of advanced wafer defect inspection and review tools, the Puma 9980 provides the highest throughput solution for production ramp monitoring by enhancing capture ...
KLA Corporation
... covering all wafer surfaces and providing parallel data collection at high throughput for efficient process control. The modules comprising the latest-generation CIRCL5 system include: front side wafer defect inspection; ...
KLA Corporation
... management within fabs. Unpatterned wafer surface inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the sub 1Xnm design nodes. Unpatterned wafer ...
KLA Corporation
... e-Beam Wafer Defect Review and Classification Systems The eDR7380™ electron-beam (e-beam) wafer defect review and classification system supports wafer and chip manufacturing for wide-bandgap semiconductors. ...
KLA Corporation
The Archer™ 800 overlay metrology system provides accurate feedback of on-product overlay error for fast technology ramps and stable production of leading-edge memory and logic devices. Wavelength tunability and optimization per layer with nanometer-level ...
KLA Corporation