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Memory size: 12 GB
... SMARC® 2.1.1 module with Qualcomm® QCS5430 processor Cpu 2x Arm® Cortex®-A78 @2.4 GHz, 4x Arm® Cortex®-A55 Memory Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit interface 2 channels Graphics Qualcomm® Adreno™ 642L Video Interfaces LVDS ...
SECO
Memory size: 0 GB - 32 GB
... applications equipped with Qualcomm® Dragonwing™ IQ8 application processors. Designed for integration on a SMARC carrier board for
industrial and commercial use.
Highlights
- CPU Qualcomm® Dragonwing™ IQ8
SECO
Memory size: 0 GB - 64 GB
... Ultra Processors (Series 2, Arrow Lake H and U). Modular board in COM-HPC Size A form factor (120 x 95 mm) for
industrial edge,
automation, vision systems and embedded clients.
Highlights
- CPU:
SECO
Memory size: 0 GB - 16 GB
... Recommended applications
- Embedded controllers, industrial automation and HMI
- Edge computing, digital signage and vision systems
- Transportation, building automation and specialized
SECO
Memory size: 0 GB - 64 GB
... Power: +12 VDC ±10%, +5 V StandBy, +3.0 V RTC
Kits
- Engineering
SECO
Memory size: 0 GB - 96 GB
... extensive I/O options.
Highlights
- CPU AMD Ryzen™ AI Embedded P100 Series (P121, P132 and industrial variants)
- Graphics Integrated AMD Radeon™ RDNA™ 3.5 GPU, up to four concurrent 4K displays
- Memory
SECO
Memory size: 0 GB - 96 GB
... Windows 11 IoT Enterprise 2021 LTSC; Clea OS.
SECO
Memory size: 0 GB - 64 GB
... Overview
COM Express Revision 3.1 Type 6 Basic module (E59) compatible with Intel® Core™ Ultra Processors Series 2 (codename Arrow Lake, H- and U-SKUs). Designed for embedded and edge systems requiring configurable CPU, advanced graphics and ...
SECO