Thermal mass flow meter GF1 series
for gasin-linestainless steel

thermal mass flow meter
thermal mass flow meter
thermal mass flow meter
thermal mass flow meter
thermal mass flow meter
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Characteristics

Technology
thermal mass
Fluid
for gas
Installation
in-line
Material
stainless steel
Communication
RS485, analog output
Supply voltage
5 VDC
Protection level
corrosion-resistant
Applications
for high flow rates
Other characteristics
digital
Volumetric flow rate

Min.: 0 l/min
(0 us gal/min)

Max.: 300 l/min
(79.3 us gal/min)

Process temperature

Min.: 0 °C
(32 °F)

Max.: 50 °C
(122 °F)

Process pressure

Min.: 0 bar
(0 psi)

Max.: 34.47 bar

Precision

0.35 %, 1 %

Repeatibility

0.15 %

Description

High purity flow path. Outstanding performance, reliability, and repeatability. Fast responding, repeatable delivery of process gases with high and ultra-high levels of purity—that’s the performance the GF100 series of metal sealed mass flow controllers and meters provides. Designed for semiconductor, MOCVD and other gas flow control applications, the GF100 series exceeds the semiconductor industry standard for reliability, ensuring repeatable, highly stable performance over time. Standard MultiFloTM technology enables one MFC to support thousands of gas types and range combinations without removing it from the gas line or compromising on accuracy. The result: increased process flexibility and efficiency combined with the industry’s highest levels of process gas purity to help maximize yields and productivity. Features • Long-term zero stability of <±0.5% full scale per year • Settling times: 700 ms - <1 second • All-metal seal flow path: option for 4µ or 10µ inch Ra surface finish • Corrosion-resistant Hastelloy® T-Rise sensor improves measurement reproducibility at elevated temperatures • MultiFloTM gas and range programmability—one device, thousands of gas types and range combinations without removing the MFC from the gas line or compromising accuracy • Local display • Optional SDS gas delivery • DeviceNetTM, RS-485 L-Protocol and analog interfaces Benefits High-performance components marathon tested to seven times semiconductor industry standards for reliability All metal, corrosion resistant flow path with reduced surface area and unswept volumes ensures faster dry-down during purge steps

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Exhibitions

Meet this supplier at the following exhibition(s):

ACHEMA 2024
ACHEMA 2024

10-14 Jun 2024 Frankfurt am Main (Germany) Hall 11.1 - Stand F26

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.