バーンイン試験用ソケット GU12-TO252-K-S74X68

KelvinトランジスタTOパッケージ用

TO Package Test Socket For TO-252/D-PAK Size12x24.9mm/0.47x0.98" Clamshell - Burn-in Test - Kelvin Contact(Option) - Cost competitive - Operating Temperature : [Acceptable Device] NTD5862N(ON Semiconductor) RD3U080AAFRA(ROHM) IXTY14N60X2(IXYS) PG-TO252-3-11(Infineon) SUD50N06-09L(Vishay) GK,DK,SK Through holes are for Kelvincontact. These holes are not necessary if Kelvin Contact is notrequired. Generally,TO-252/D-PAK package size is specified. However, the size depends on the semiconductor manufacturers and devices. If you send us your device in advance,we can properly confirm its adoption. In order to use the test socket for a long time, we recommend regular cleaning.