OverviewEvaluate 2D distribution of strain (retardation) on low-phase-difference samples such as semiconductor wafers, colored glass and colored acrylic resin products. Capable of evaluating up to approx. 50×50 mm in about 1 minute.
Model nameFully Automatic Strain Eye LSM-9001NIR
Inspection methodNIR Rotating Analyzer Method
Key features- Fully automatic measurement: place the sample and start measurement; results are calculated from images captured by the built-in camera without subjective judgment, reducing operator workload and measurement variability.
- Measures strain, residual stress and cracks on semiconductor wafers and colored or transparent products that are difficult to assess with conventional polariscopes.
- Comprehensive software analysis: 2D distribution maps with cross-section graphs, histograms for arbitrary areas, 3D visualization, CSV export of results and image storage for traceable analysis.
- High-luminance LED light source for long life and reduced power consumption, lowering maintenance and operating costs.
Specification- Inspection Method: NIR Rotating Analyzer Method
- Measurement Range (approx.): 0–150 nm (retardation)
- Measurement area size (approx.): 50×50 mm
- Measurement time: approx. 1 minute for 50×50 mm
- Measurement object placement space (height): Max 160 mm
- Size: W300 × D353 × H540 mm
- Weight: 22 kg
- Light Source: high-luminance LED
- Power Source: AC100–240V 50/60Hz; DC input 24V 1.6A
- Components: Main body, PC, Cables; Accessory: Main body cover
- OS: Windows 10 Pro (64bit) Japanese/English