Rockwell hardness tester Qness E EVO series

BrinellVickersKnoop/Vickers

Introduction
A universal macro hardness tester for laboratory and industrial environments. Fixed component support and extra-large test table area allow hardness testing of very large components. The E version features a motorized, dynamically controlled test head. The device secures test pieces of virtually any size, with clamping force adapted to the test method. Maximum test height: 510 mm. Maximum clamping force (E version): up to 3500 kg.

Key Features

• Dynamic height adjustment with potentiometer control (8 mm/s) and optional 2-hand-safety device for up to 17 mm/s movement.
• 8-position compact tool changer (rotational axis angle 15°) for fast change-over between Brinell, Knoop, Rockwell and Vickers tools.
• Swiveling downholder for easy access to otherwise inaccessible test positions; clamping elements are easily changeable and adaptable.
• Workpiece recognition with motorized height adjustment and sensors to detect the workpiece and reduce bracing speed to protect device and part.
• Maximum clamping safety through a high-performance induction motor (E version) with automatic clamping adaptation above the test force.
• Optional extended machine frame for test heights greater than standard 510 mm (customized dimensions available).
• XLED illumination and XLED Brinell evaluation lenses for precise, repeatable Brinell indentation analysis across materials.
• 5 MP Ethernet industrial camera system (up to 270 FPS) and modern Ethernet camera technology for stable transmission and remote-PC placement.
• 12-inch capacitive touch display, freely tiltable and height-adjustable for ergonomic operation; Qpix T2 software (option Qpix CONTROL 2 M).
• Optimized EVO series improvements: faster Windows 10/11 IoT PC, shorter autofocus and image evaluation times, reduced cycle times and quieter operation.

Software & Connectivity

• Qpix T2 software (option Qpix CONTROL 2 M) for test control and evaluation.
• Integration with Verder Scientific IoT platform (VS IoT) for remote monitoring, live notifications, automatic backups and free/automatic software updates.
• Qconnect interface for Industry 4.0 connectivity: REPORT, PDF, XML, CSV, Q-DAS, IOT, LIMS, OPC UA, ERP integrations and more.

Test Method Flexibility

• Supports Brinell, Vickers, Rockwell and Knoop hardness testing as well as tests for plastics.
• Tool positions: standard 2 positions or optional 8-position tool changer for multiple test methods without manual tool swap.

Technical specifications

• Supported test methods: Brinell, Vickers, Rockwell, Knoop, Plastics.
• Test force range: Qness 250 E EVO: 1 - 250 kg (9.81 - 2450 N); Qness 750 E EVO: 0.3 - 750 kg (2.94 - 7358 N); Qness 3000 E: 0.3 - 3000 kg (2.94 - 29430 N).
• Height adjustment: electrical / asynchronous motor.
• Test height (max) / Throat depth: 510 mm / 320 mm.
• Test anvil (test table area): 584 x 450 mm.
• Max. workpiece weight: unlimited (device able to clamp very heavy/bulky parts; clamping force up to 3500 kg in E version).
• Weight of base machine: 500 kg.
• Test sequence: fully automatic with electronic force control.
• Camera system / Image transfer: 5 MP Ethernet industrial standard; up to 270 FPS.
• Tool positions: 2 (standard) or optional 8 (tool changer).
• Software: Qpix T2 (option: Qpix CONTROL 2 M).
• Operating system / Storage: Windows 11 IoT / 128 GB SSD.
• Data interfaces: 2x USB 3.0, 2x USB 2.0, 1x RJ45 (Ethernet), 1x RS232, 1x DisplayPort.
• Lenses / Optical ranges: XLED 1, XLED 2, XLED 5, plus standard objectives 5x, 10x, 20x, 50x, 100x.
• Fields of view (depending on lens selection): from 0.113 x 0.084 mm (100x) up to 7.98 x 5.97 mm (XLED 1).
• Display: Capacitive 12-inch touch display.
• Power connection: 230~ 50-60Hz 1/N/PE (option: 110~ 1/N/PE).
• Max. power consumption: ~1230 W.
• Additional options: designer pedestal, collision protection, cross laser, additional test anvils, prisms, automation/data connection options, barcode/QR reader, transparent collision guard, extended frame for increased test height, etc.