Laser perforating machine LO

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This equipment is designed to make MICRO HOLES through laser sources on moving films of various materials and thicknesses and is to be inserted as a host unit in film processing lines, such as in slitters, extruders, packaging machines, printing and welding machines. The LASER-ONE model guarantees perfect micro holes even on multi-layer, single or bi-oriented laminated materials. It is ideal for delicate processing such as MICRO-PERFORATION and SCORING on packages for the IV AND V RANGE, for MAP PACKS and EMAP PACKS. With the holes made by this device, air exchange with the outside of the packages can be controlled. By inducing CONTROLLED PERMEABILITY, it is possible, for example, to increase the SHELF LIFE of all fresh products. The running film, held in perfect tension by the idler rollers, arrives at the device and is perforated by the CO2 LASER through the emission of BEAMS OF LIGHT WITH INFRARED FREQUENCY. These beams are subsequently "combed" and expanded by the BEAM EXPANDER. The light beams are then focused on a reduced and circumscribed film surface by means of a FOCUSING LENS. Micro-perforation is achieved by sublimation of the material, caused by the heat of the laser beam. Operation and Adjustment OPERATION and ADJUSTMENT of the LASER-ONE is entrusted to our software with 4.0 predisposition. From the electrical control panel, the operator, via touch screen, manages all operations inherent to the device such as adjusting the laser pulses, diameter and position of the holes.