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Memory size: 8 GB
... Module (OSM 1.1) System-on-Module from DFI based on the Qualcomm QRB5165 SoC. It is engineered for compact industrial and embedded applications such as AMR, robotics and drones, where multi-camera support, dual-display capability and ...
DFI
Memory size: 4, 8, 16 GB
... The EHL701 is a Qseven System-on-Module by DFI for
embedded and industrial applications, supporting Intel® Atom® x6000 series and Intel® N/J series processors in a compact 70 × 70 mm Qseven form factor.
Key features
- Form
DFI
Memory size: 2, 4, 8 GB
... form-factor System-on-Module from DFI, powered by Rockchip RK3568 / RK3568J quad‑core Cortex‑A55 processors. It is designed for embedded and edge systems that require multi-display support, multiple expansion interfaces and configurable ...
DFI
PICMG system-on-moduleMTH966
Memory size: 0 GB - 32 GB
... Overview
The MTH966 is a COM Express® Compact Type 6 system-on-module by DFI, built for industrial and
embedded applications that require high compute density, multiple display outputs and extensive I/O expansion. It is ...
DFI
Memory size: 0 GB - 16 GB
... Overview
The ASL968 is a COM Express® Compact Type 6 module from DFI designed for rugged and industrial
embedded systems. It supports Intel® Atom® x7000RE (Amston Lake) and Intel® Core™ 3 / N-series (Twin Lake) processors, ...
DFI
Memory size: 8, 16 GB
... from DFI, powered by Intel® Atom® / Core / Pentium / Celeron processors (Alder Lake‑N family). It is engineered for fanless embedded applications, supports LPDDR5 memory and offers multiple high-speed I/O, expansion and dual-display options ...
DFI
Memory size: 0 GB - 32 GB
... Overview
The MTU9A2 is a COM Express Mini (Type 10) System-on-Module from DFI for
embedded and industrial applications. It integrates Intel® Core™ Ultra (Meteor Lake U-series) processors, supports LPDDR5 memory up to 32GB, provides ...
DFI
Memory size: 0 GB - 16 GB
... /li>
Detailed Description
- DFI's new-gen EHL Series embedded computing solutions powered by the Intel® Atom™ x6000 series processors are tailored to enhance the management
DFI
Memory size: 32 GB
... Dual channel DDR4 2400/3200MHz SODIMM up to 32GB Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default)；Supports up to four independent displays DP++ resolution supports up to 4096x2304 @ 60Hz Multiple expansion: 1 PCIe x8, 7 PCIe x1 Rich I/O: 1 ...
DFI
Memory size: 16 GB
... Dual channel DDR4 2400MHz onboard Memory up to 16GB Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays eDP resolution supports up to 4096x2304 @ 60Hz Multiple expansion: 1 PCIe x16, 8 PCIe x1 Rich I/O: 1 Intel GbE, 4 ...
DFI
... ARM Cortex-A53 NXP i.MX8M Mini, Small Footprint, System-on-Module. WiFi 802.11ac and Bluetooth communication interfaces. Linux, Android, Ubuntu and Yocto source code. Open carrier board specifications, design guides, and schematics. Pre-loaded plug ...
TechNexion Ltd.
... Main Features TechNexion AXON-IMX8M-MINI is a high-performance and reliability SoM featuring NXP i.MX8M Mini applications processor based on ARM Cortex-A53 and Cortex-M4 architecture that provides industry-leading computing performance, eciency and ...
TechNexion Ltd.
... Main Features TechNexion FLEX-IMX8M-MINI is a high-performance and reliability SoM featuring NXP i.MX8M Mini applications processor based on ARM Cortex-A53 and Cortex-M4 architecture that provides industry-leading computing performance, eciency and ...
TechNexion Ltd.
... ARM Cortex-A53 NXP i.MX8M, Small Footprint, System-on-Module. WiFi 802.11ac and Bluetooth 5 communication interfaces. Linux, Android and Yocto source code. Open carrier board specifications, design guides, and schematics. Pre-loaded plug and play ...
TechNexion Ltd.
... Main Features: The PICO-IMX7 design based on the NXP i.MX7 multi-market applications processor is designed to enable secure and portable applications within the Internet of Things. Pin-compatible with the Intel Edison for sensors and low-speed I/O, ...
TechNexion Ltd.
... EDM-IMX7 is an ARM Cortex-A7 + M4 NXP i.MX7 based, scalable single/dual core EDM Type 1 compact System on Module. Dual Gigabit LAN, Wi-Fi 802.11 a/b/g/n/ac and Bluetooth 5 communication interface. Targeting multimedia applications with LVDS, TTL, S/PDIF, ...
TechNexion Ltd.