The NEXIV VMR-C4540 - designed for use with 300mm Front Opening Unified Pod (FOUP) & Front Opening Shipping Box (FOSB) ...
One of Nikon's most advanced and versatile semiconductor inspection systems, the Optistation ...
Semiconductor inspection systems: AMI, Optistation and Nexiv
Advanced, versatile semiconductor inspection and wafer management systems
Manufacturing equipment from steppers to the most sophisticated inspection systems has given Nikon invaluable experience in the field of microelectronics. This experience has allowed Nikon to ...
JEOL wafer and mask review tools improve yield management with unique capabilities that help rapidly detect minute imperfections ...
The Beam Tracer, JFAS-7000BT, is designed to identify the precise position of semiconductor device defects at high resolution.
The Beam Tracer is a scanning ...
The IP321 combines conversion of Gerber data and the automatic recognition function for ease of programming. New data can be created easily and rapidly as compared ...
Panasonic's IP121 high speed 3D laser post-reflow PCB inspection machine provides industry-leading accuracy via our 3D laser innovation. Realizing 100% inspection real time and 0402 (01005) capability on up to 18" x 20" boards, the IP121 improves ...
The Model 2520 Pulsed Laser Diode Test System is an integrated, synchronized system for testing laser diodes early in the manufacturing ...
The pcba|inspector is a high-resolution microfocus X-ray inspection system designed for inspecting solder joints in board assemblies.
Possible ...
The microme|x is a high-resolution submicron X-ray system for the inspection of solder joints and electronic components.
Equipped with the fully automated µAXI inspection software x|act, the microme|x offers fast and easy CAD programming as well as highest defect coverage ...
The high-speed technologies used in high-end test systems are implemented ...
This next-generation memory test system for evaluation, analysis and volume production offers significantly improved cost performance and is suitable for conducting package tests for many kinds of memory devices.
Features & Performance
High Cost Performance · Simultaneous Testing of Two Device Types
(1) In a single ...
This next-generation memory test system offers significantly improved cost performance and is suitable for testing all kinds of memory devices on 300 mm wafers.
Features & Performance
High Cost Performance · Simultaneous Testing of Two Device Types
(1) In a single test head configuration, ...
Reduce your cost of test with the LRS-9550 high power laser diode life-test and burn-in system. With up to eight independent temperature controlled shelves supporting up to 512 high power devices per system, you will be able to run multiple independent tests, increase throughput, and lower your cost of test.
The LRS-9550's flexible design allows you to ...
The LTS-9110 Laser Diode Test System combines the LPA-9080, SPA-9000, a leading edge control computer, and your choice of laser diode fixture and optical power/wavelength measurement head all into one complete package. You choose the instrument: the LPA-9082 for applications requiring up to 500mA laser drive current or the LPA-9084 if you need ...
The LRS-9424B Laser Reliability and Burn-In Test System is the second generation of ILX Lightwave's successful 9424 platform and offers precision and flexibility at an affordable price. With up to 1024 devices in the LRS-9424Bs compact chamber, you will be able to increase throughput and lower your overall cost of test. The LRS-9424Bs proven laser ...
The continued demand for higher-density chips with smaller critical dimensions leads to tighter substrate form tolerances both on the global scale and on the individual die-site scale. Corning Tropel has optimized our patented grazing-incidence interferometry technology for the highest-precision ...
Solder Printing Inspection Machine VP6000
This is an in-line type solder printing inspection machine, pursuing High Speed, High Accuracy and Simple Operation.
The ...
Solder Printing Inspection Machine VP5200
This is an in-line type solder printing inspection machine which achieves the fastest speed in the market, and pursues high accuracy and simple ...
In-line type SPI with high speed, high precision and simple operation that was largely improved from former one.
By ...
Air beared XYZ drive system in portal construction, consisting of 2D-Planar stage and precision Z-axis
General description
The 3D Micro machining system LPKF PROSYS was especially designed for micro chipping of non iron metals and tool steels. Another wide field of application is a measuring table usage. The integrated granite portal can be used for mounting a Z-axis, a milling spindle ...
LPKF ScanCheck MicroView
Inspection system for waferbump stencils and precision sencils with highest packing density (High-Density Stencils)
The LPKF ScanCheck MicroView is the inspection system to use for the finest quality waferbump stencils and precision screens. This is possible due to its top resolution of ...
LPKF ScanCheck I+
Inspection System for solder paste stencils
The LPKF ScanCheck I+ Stencil Inspection System compares solder paste stencils manufactured by any method with the CAM data. ...
High-Throughput Automated Solar Cell Tester
The Spi-Cell Sorter™ sorts photovoltaic cells according to their electrical performance, tested under simulated sunlight. A pulsed xenon lamp with an optical filter ...
Automates Spi-Sun Simulator, Hi-Pot & Labeling
The Spi-Module QA is an automated photovoltaic module testing system that combines the advanced I-V measurement capabilities of the Spi-Sun Simulator with high voltage isolation (Hi-Pot) and ground continuity testing. Integrated automation ...
High Resolution Inspection for Solar Modules
The Spi-EL series of solar module testers uses electroluminescence (EL) measurements to identify microcracks and other invisible defects in modules. The testers utilize cooled near-infrared CCD camera technology ...
colorCONTROL MFA is used for quality ...
The “dimensionCONTROL 8260 for Ingot” measuring system inspects the surface of the bricks using several laser line scanners and in doing so measures the side lengths, phase ...
The wafer edge inspection system measures the surface of the wafer with high precision using three image processing cameras. Defects larger than ...
The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 200SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate ...
The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer ...
Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including:
* Silicon
* Gallium-Arsenide
* Indium Phosphide
* Germanium
...without recalibrating or electrically grounding ...
