Optical inspection machine 29 series

for patterned wafersfor the electronics industryhigh-resolution

Overview
Comprehensive wafer defect inspection and review systems for discovery, classification and monitoring of pattern and surface defects across R&D and production. Systems combine broadband optical illumination (including SR‑DUV), laser scanners and e‑beam review with advanced sensors and AI-driven algorithms to detect defects on frontside, backside and edges for multiple wafer sizes and substrate types.

Product Series and Summaries

• 39xx Series: Super-resolution broadband plasma patterned wafer inspection for advanced logic and leading-edge memory (≤5–7nm). Features SR‑DUV illumination, low-noise sensors, advanced ML algorithms, Setup 2.0 and DualSENS™ linkage to e‑beam review.
• 29xx Series: Broadband plasma inspectors (DUV/UV/visible) for multi-layer sensitivity and Super•Pixel™ detection across logic and memory nodes.
• C30x Series: Tunable broadband inspection for 200/300mm wafers with NanoPoint™ focusing, selectable apertures and high data-rate sensors for R&D and production.
• Voyager® / Puma™: Laser scanning patterned wafer inspectors optimized for production ramp and high throughput, with DefectWise® deep learning and NanoPoint™ design-aware capability.
• 8 Series: High-productivity broadband inspection for diverse substrates (Si, SiC, GaN, glass) and wafer sizes (150/200/300mm) with DesignWise® and DefectWise® AI.
• Micro-SR™ / CIRCL™ / Castor™: Optical review, modular cluster and integrated inspection + 3D metrology solutions for frontside/backside/edge review and parallel data collection.
• Surfscan®: Unpatterned wafer inspection (DUV lasers) for tool qualification, EUV resist qualification and IQC/OQC with image-based classification (IBC).
• eDRX / eDR7xxx / eSL10™: E‑beam review and patterned e‑beam inspection systems delivering high-resolution imaging, Simul-6™ multi-contrast capture and SMARTs™ AI for DOI discrimination.

Applications

• Defect discovery and hotspot detection
• Process debug, R&D engineering analysis
• EUV/193i print check and resist qualification
• Tool, line and process window monitoring and qualification
• Incoming / outgoing wafer quality control (IQC / OQC)

Systems & Software Ecosystem

• Integration with inline automation and sampling (DirectedSampling™, I‑PAT®) for zero-defect and screening workflows
• Data and image analysis with DefectWise®, aiSIGHT, Klarity® and other ML/AI toolkits
• Optical↔e‑beam connectivity (DualSENS™, OptiSens™) to accelerate yield learning and linked review

Key Features / Technical Specifications

• SR‑DUV and tunable broadband illumination; DUV/UV/visible operation
• Selectable optical apertures and NanoPoint™/DesignWise® focused inspection modes
• Low-noise, high data-rate sensors for high sensitivity and throughput
• Advanced ML algorithms for nuisance suppression and DOI separation (DefectWise®, SMARTs™)
• Simul-6™ and Yellowstone™ scanning mode for combined contrast and high-speed e‑beam imaging
• Support for 150 / 200 / 300mm wafers and multiple substrates (Si, SiC, GaN, glass, sapphire, etc.)