{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
... Overview
The SCT4090KTWHR is a
SiC
MOSFET in the TSC3PAK surface-mount package featuring top-side heat dissipation. TSC3PAK provides heat dissipation comparable to TO-247 class through-hole packages while enabling ...
ROHM Semiconductor
... Overview
This
SiC
MOSFET in a TSC3PAK surface-mount package features a top-side heat dissipation structure that places the thermal surface on the package top, enabling automated PCB mounting while delivering ...
ROHM Semiconductor
... Overview
This
SiC
MOSFET SCT4062KTWHR in TSC3PAK is designed for high‑voltage power conversion and switching applications. The device combines low ON resistance and fast switching to reduce switching losses ...
ROHM Semiconductor
... Overview
This
SiC
MOSFET is supplied in the TSC3PAK surface-mount package featuring a top-side heat-dissipation surface and a proprietary groove to secure a creepage distance of 6.66 mm. The device supports ...
ROHM Semiconductor
... Overview
This device is a
SiC
MOSFET in a TSC3PAK surface-mount package. The top-side heat dissipation structure places the thermal surface on the package top, enabling automated mounting while delivering heat ...
ROHM Semiconductor
... Overview
This
SiC
MOSFET in a TSC3PAK surface-mount package features top-side heat dissipation, delivering through-hole comparable thermal performance while enabling automated SMD mounting. ROHM's proprietary ...
ROHM Semiconductor
... Overview
This
SiC
MOSFET in a TSC3PAK surface-mount package provides low ON-resistance and high-speed switching for high-voltage power conversion. The package uses a top-side heat dissipation structure to enable ...
ROHM Semiconductor
... Overview
This device is a
SiC
MOSFET in a TSC3PAK surface-mount package with a top-side heat dissipation structure. The package places the thermal dissipation surface on the top of the package, providing heat ...
ROHM Semiconductor
... Product Overview
This component is a 1200 V, 31 A
Silicon-
Carbide (SiC)
MOSFET, model SCT4050KTW, in the TSC3PAK surface-mount package. The package uses a top-side heat dissipation structure ...
ROHM Semiconductor
...
- Part number (product page): SCT4018KTWHRTCR (also referenced as SCT4018KTWHR)
- Device type: Silicon-carbide (SiC) MOSFET
- Package: TSC3PAK (surface-mount, top-side heat dissipation)
- VDSS
ROHM Semiconductor
... generation of EliteSiC Silicon Carbide (SiC) MOSFETs in bare die format - optimized for use in high power applications such as EV Traction inverters, DC-DC converters, and off-board chargers. Based on ...
the best suppliers