{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
Placement accuracy: 5 µm - 5 µm
... The LQ-FC200US is a hot-press ultrasonic flip-chip mounting system designed for high-throughput, high-precision solid-state mounting and multi-process bonding. It features an operator-friendly large color touch panel with dialog-style ...
Placement accuracy: 3 µm - 3 µm
... Overview
The FiNEXT P3 is a next-generation 12-inch
die-bonding production platform that integrates
ultrasonic, adhesive and eutectic bonding methods to deliver stable yields, consistent quality and accelerated ...
Finetech
Placement accuracy: 2 µm
... Automatic Multi-Purpose Bonder The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision and versatility with a focus ...
Finetech
the best suppliers