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Memory size: 0 GB - 16 GB
... Overview
- COM Express Type 6 compact module (95 mm × 95 mm) for embedded systems
- Supports Intel Atom® X Series / N-series and Intel Core™ processors — maximum CPU TDP 15 W
- Onboard LPDDR5 memory, configurable up to 16 GB
- Integrated
AAEON
Memory size: 0 GB - 16 GB
... Overview
COM-TWLC6 Rev.B is a COM Express Type 6 Compact size module designed for embedded systems and industrial applications, supporting Intel Atom® N-series and Intel Core™ processors with a maximum TDP of 15W.
Key features
- Intel
AAEON
Memory size: 0 GB - 16 GB
... Overview
COM-ASLC6 Rev.B — COM Express Type 6 compact module featuring Intel Atom® X Series processors. Designed for compact COM Express Type 6 applications with a 95 mm × 95 mm footprint.
Key features
- Intel Atom® X
AAEON
Memory size: 0 GB - 192 GB
... Overview
The RPS9HC is a COM-HPC® Client Size C system-on-module family for high-performance embedded computing. It supports 14th and 13th Gen Intel® Core™ processors, DDR5 memory, multiple high-speed expansions and quad independent displays ...
DFI
Memory size: 2, 4, 8 GB
The RK701 is a Qseven form-factor System-on-Module from DFI, powered by Rockchip RK3568 / RK3568J quad‑core Cortex‑A55 processors. It is designed for embedded and edge systems that require multi-display support, multiple expansion interfaces and configurable ...
DFI
Memory size: 0 GB - 96 GB
... The TGH960 is a COM Express® Basic (Type 6) system-on-module from DFI designed for industrial applications that require high I/O density, multiple expansion lanes and long CPU lifecycle support.
Highlights
- COM Express® Basic (Type
DFI
Memory size: 0 GB - 16 GB
... SMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N) Video Interfaces - Integrated Intel® UHD Graphics driven by Intel® Xe ...
SECO
Memory size: 64 GB
COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (LAGOON - D57)
SECO
Memory size: 0 GB - 64 GB
... COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (formerly codenamed Raptor Lake-P) Graphics Intel® UHD Graphics/Intel® Iris® Xe Graphics architecture, up to 96 EU Improved image (IPU6EP) and video processing ...
SECO
Memory size: 96 GB
... Product Overview
COM Express Type 6 Compact-size computer-on-module PCOM-B65C with AMD Ryzen™ Embedded 8000 family support. Designed for embedded and industrial applications requiring high CPU/GPU performance, extensive PCIe lanes and flexible ...
Memory size: 0 GB - 32 GB
... 1 x Intel® I226LM/IT Intel® HD Audio Integrated on CPU Onboard nuvoTon_NPCT754AADYX TPM 2.0 DC in +9V ~ +19V System Information I/O Chipset EC iTE IT5782 Watchdog Timer H/W Reset, 1Sec. ~ 65535Sec. and ...
Memory size: 32, 64 GB
... *45W CPU SKUs are available upon request Chipset - MCP BIOS - AMI SPI 256 Mbit Form Factor Dimensions - COM Express Compact Type 6 (3.74-in x 3.74-in x 0.52-in, 9.5 cm x 9.5 cm x 1.3 cm) Memory Technology - Dual Channel DDR4 3200 MHz Socket ...
ASRock Industrial
Memory size: 64 GB
... Intel Alder Lake COM-E core module Support 2 x SATA3.0 Support 4x display output, 3 x DD1 for HDMI/DP, 1 x DD1 for VGA Dimension: 95*95*2.0mm ...
ZRT Technology
Memory size: 4, 8 GB
The RK3576 processor offers high-performance data processing capabilities, enabling intelligent AI analysis, a diverse display and operation experience, as well as robust scalability and compatibility. It features a quad-core A72 and a quad-core A53 processor, ...
... COM Express Type 6 Compact Size with Intel® J6412 Processor Specification Form Factor - COM Express® R3.0 Compact Module, Type 6 95W x 95D (mm) CPU - Intel® Celeron® J6412 Processor 10nm, 4 cores, 4 threads, up to 2.60 GHz TDP 10W Socket - ...
... COM-HPC Client Size A high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake") COM HPC Client Size A PCI Express Gen 4 Embedded/Industrial use condition Extended temperature options available Integrated high ...
Congatec
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