Remote-controlled materials handling system NWL200

automatedPC-controllableelectronically controlled

Overview
The NWL200 wafer loader family provides automated transfer and handling for 6" (150 mm) and 8" (200 mm) semiconductor wafers, with options to handle ultra‑thin wafers down to 100 µm. Designed for integration with optical microscopes and video measuring systems, the NWL200 targets high throughput and safe wafer handling in production inspection lines.

Compatibility and general capability

• Supports 6" (150 mm) and 8" (200 mm) wafer diameters.
• Integrates with Nikon Eclipse L200N, LV150N microscopes and NEXIV VMZ‑S video measuring systems.
• Standard handling for 300 µm and 200 µm wafers; optional chuck for 100 µm ultra‑thin wafers.

Key capabilities & handling

• Multi‑arm load/unload system for rapid, accurate wafer transfer.
• Fast cassette elevator with non‑contact centring for precise alignment.
• Macro inspection support for front‑side pattern, back periphery and centre‑area inspection.
• Programmable rotation speed and tilt angle (auto/manual) to support varied inspection tasks.
• Vacuum chuck on the macro arm remains active during unexpected power interruptions to allow safe wafer removal.

Clean‑room and anti‑contamination design
Continuous airflow in vacuum clamping and centring zones minimises particle generation. Stainless‑steel loader cover reduces static accumulation to support clean‑room requirements.

Safety and wafer sensing

• Wafer sensing beams and arranged sensors detect warped or distorted thin wafers in cassettes and abort collection to prevent collisions.
• Collision‑avoidance logic reduces risk of wafer damage during transfer operations.

Usability and ergonomics

• Operator‑focused front panel: single‑button wafer selection, large LCD and structured menu for recipe and system control.
• Loading position and cassette exchange angled at 35° left for ergonomic access and faster operator handling.

Remote operation and support

• Remote Access Web Server tool enables LAN connection via browser wizard for creating, editing and backing up inspection recipes.
• Remote recipe writing and backup help maintain inspection continuity and optimise throughput.

Technical specifications

• Supported wafer diameters: 6" (150 mm) and 8" (200 mm).
• Handled thickness: standard 300 µm and 200 µm; optional 100 µm ultra‑thin chuck.
• Compatible systems: Nikon Eclipse L200N, LV150N; NEXIV VMZ‑S video measuring system.
• Loading/unloading: multi‑arm transfer with fast cassette elevator and non‑contact centring.
• Inspection modes: front‑side pattern, back periphery, centre area; adjustable rotation and tilt (auto/manual).
• Contamination control: continuous airflow in vacuum area; stainless‑steel cover for static reduction.
• Safety: wafer sensing for collision avoidance; vacuum chuck retains hold during power loss for safe removal.
• Operator interface: single‑button selection, large LCD, structured recipe menu; remote web access for recipe management.