Magnetic probe station DX1PS3

manual

The Wafer Level in-plane Magnetic Field Probe Station is a wafer-scale testing platform designed to apply controlled in-plane magnetic fields and enable electrical characterization at wafer level. It provides real-time magnetic field monitoring and a versatile probe platform for DC and RF measurements.

Key features

• Applies controlled in-plane magnetic fields for wafer-level probing with a universal structural design (magnet excluded).
• Real-time magnetic field monitoring and feedback for stable measurement conditions.
• Supports multiple probe types (DC and microwave) and a rapid Z-axis probe lifting platform to improve testing efficiency.
• Designed for compatibility with wafer-level testing workflows and multiple probe sets for flexible measurements.

Technical specifications

• Model: DX1PS3
• Magnetic field direction: In-plane
• Magnetic field strength: In-plane magnetic field >330 mT
• Air gap adjustable: No
• Sample size: 12-inch wafer (downward compatible with fragmentation test)
• Probe type and quantity: DC probes (set of 4) or microwave probes (set of 4)
• Sample stage parameters: XY electric control travel ±150 mm, adjustment accuracy 2 μm; T-axis manual adjustment ±5°, minimum adjustment accuracy 5°
• Microscope type: Monocular microscope
• Magnetic field uniformity: ±1% @ φ1 mm (structural versatility design, magnet excluded)
• Magnetic field monitoring: Real-time with monitoring accuracy <1% and field resolution <0.02 mT
• Compatibility: Holds up to 12-inch wafers and is backward compatible with 8-inch and 6-inch chips
• Probe platform: Z-axis probe platform with rapid lifting function (manual by default; can be upgraded to electric control)