Automatic probe station DX1PS3

magnetic

Overview

The magnetic field probe station DX series provides controlled magnetic field and variable‑temperature environments for electrical and magnetic characterization of semiconductors, micro‑/nano devices, magnetic materials and spintronic devices. Systems support high‑precision DC and RF measurements and are offered in modular configurations suitable for research labs and production environments.

Available models and main parameters

• DX1PS1 — One‑dimensional in‑plane magnetic field probe station
  • In‑plane magnetic field: max 0.5 T @ 3 cm pole spacing; 1 T @ 1.5 cm pole spacing.
  • Includes bipolar magnetic field power supply and magnetic field control software.
  • Probe options: DC probe base + 2 pairs of probes, or RF probe base + 1 pair; probe base movable in three dimensions.
  • 4‑dimensional high‑precision translation stage (X‑Y‑Z + rotation), 200× stereo or metallurgical microscope with CCD camera.
• DX1PS2 — One‑dimensional vertical magnetic field probe station
  • Vertical magnetic field: up to 1.2 T.
  • Includes bipolar magnetic field power supply and magnetic field control software.
  • Probe options: DC probe base + 2 pairs, or RF probe base + 1 pair; probe base movable in three dimensions.
  • 4‑dimensional high‑precision translation stage (X‑Y‑Z + 90° rotation), 200× metallurgical microscope with CCD camera.
• DX2PS1 — X‑Y two‑dimensional magnetic field probe station
  • Two‑dimensional vector field in X‑Y plane: max 0.4 T @ 2 cm; 0.6 T @ 1 cm; 0.8 T @ 0.6 cm.
  • Includes bipolar supply and control software; fastest magnetic field scanning speed: 5 Hz.
  • Probe options: DC probe base + 2 pairs, or RF probe base + 1 pair; probe base movable in three dimensions.
  • 4‑dimensional high‑precision translation stage (X‑Y‑Z + rotation), 200× metallurgical or stereo microscope with CCD camera.
• DX2PS2 — X‑Z two‑dimensional magnetic field probe station
  • X‑Z plane two‑dimensional vector field (in‑plane + vertical).
  • In‑plane: max 0.4 T @ 2 cm; 0.6 T @ 1 cm. Vertical: max 0.6 T.
  • Includes bipolar supply and control software; fastest scanning speed: 5 Hz.
  • Probe options: DC probe base + 2 pairs, or RF probe base + 1 pair; probe base movable in three dimensions.
  • 4‑dimensional high‑precision translation stage (X‑Y‑Z + 90° rotation), 200× metallurgical microscope with CCD camera.
• DX3PS — Three‑dimensional magnetic field probe station
  • X‑Y‑Z 3D vector field: max field in any direction 0.5 T.
  • Includes bipolar supply and control software; fastest scanning speed: 5 Hz.
  • Probe options: DC probe base + 2 pairs, or RF probe base + 1 pair; probe base movable in three dimensions.
  • 3‑dimensional high‑precision translation stage (X‑Y‑Z), 200× metallurgical microscope with CCD camera.
• DX1PS3 — DX1PS3 Wafer Level Automatic In‑plane Magnetic Field Probe Station
  • Wafer‑level automatic in‑plane station for electrical and magnetic testing; provides ~330 mT one‑dimensional in‑plane field and supports high‑precision DC/RF measurements.

Technical specifications

• Applications: semiconductor industry, MEMS, superconductivity, electronics, ferroelectrics, physics and materials research.
• Bipolar magnetic field power supply with dedicated magnetic field control software (real‑time control and monitoring).
• Probe configurations: DC probe base with two pairs of probes or RF probe base with one pair; 3D movable probe base for accurate positioning.
• Translation stages: high‑precision multi‑axis stages (X‑Y‑Z with rotation or dedicated 3D stages) for sub‑millimeter positioning and rotation alignment.
• Optical inspection: 200× stereo or metallurgical microscopes with CCD camera integration for sample observation and imaging.
• Magnetic field performance: model‑dependent maximum strengths (see model items). Wafer‑level units target field uniformity (±1% @ Ø1 mm) and monitoring accuracy better than 1% with resolution < 0.02 mT for specific models.
• Magnetic field scanning: selected models support fast scanning up to 5 Hz for dynamic measurements.
• Modularity and expandability: systems designed for upgrades and customization (different magnet types and accessory options available).

Probe, measurement and control

• Integrated control software for magnetic field setting, real‑time monitoring and data logging.
• Support for DC and RF probes and compatibility with common semiconductor probe cards and measurement instruments.
• High‑precision positioning and rotation enable reproducible contact and alignment for electrical characterization.

Applications and industries

• University and institute research, semiconductor R&D and production tests, spintronics and magnetic material characterization.
• Suitable for device development, wafer‑level testing and dynamic field‑dependent measurements.