Flip-chip die bonder 9800 TC next

automatedfor the semiconductor industryhigh-accuracy

The 9800 TC next is the latest innovation in thermo compression bonding, designed to meet the evolving trends and stringent requirements of advanced packaging. Engineered for excellence, this system features significantly enhanced key performance indicators, ensuring superior results in every application. Highlights of the 9800 TC next Advanced Micro-Inert Chamber Optimized for minimal gas consumption, this critical assembly ensures efficient operation and cost savings. Unmatched Accuracy and Stability Achieve precise bonding with long-term stability, perfect for advancing bump pitch scaling plans. Powerful Bonding Capabilities The 9800 TC next delivers bonding forces up to 500 N, with an optional upgrade to 1 kN, accommodating a variety of bonding needs. High-Resolution Vision Systems Ensures precise alignment and inspection, crucial for maintaining high quality standards. Thin Die Capability Expertly handles thin dies, expanding your application possibilities. Superior Process Control Advanced monitoring functions provide unparalleled control over the bonding process. Configurable Material Feeding System: Offers incredible flexibility, allowing for customized material handling to suit diverse requirements. The 9800 TC next supports a wide range of applications, providing the versatility and performance you need to stay ahead in the rapidly evolving landscape of advanced packaging.