Flip-chip die bonder Datacon 8800 FC QUANTUM advX

fully-automaticfor the semiconductor industryhigh-accuracy

Elevate Your Manufacturing Efficiency with the Datacon 8800 FC QUANTUM advX Experience the next generation of Flip Chip assembly with the Datacon 8800 FC QUANTUM advX, our most advanced solution yet. Engineered to deliver extraordinary speed and precision, this state-of-the-art system is the perfect choice for high-volume production environments. Supporting die sizes from 0.3 to 40 mm, the Datacon 8800 FC QUANTUM advX offers unmatched versatility to meet the full spectrum of mass reflow Chip-to-Substrate (C2S) applications. With an outstanding placement accuracy of just 4 μm, it pushes the boundaries of what is possible in small bump mass reflow technology. Key Features Unprecedented Speed ​ Dual gantry system ​ Super size CRYSTAL dipping ​ Newest Besi vision technology Full Yield Control ​ Auto needle height determination ​ Flip touchdown monitoring ​ Flux depending dipping speed sets Proven Production Accuracy ​ 4μm at highest speed ​ High resolution vision system ​ Thermally optimized gantry system Application Flexibility ​ FC-BGA, FC-CSP, DRAM, Fan-out C2W ​ Die size up to 40 mm ​ Singulated substrates, strips and wafer