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Pulsed laser source VLM/VLR
nanosecondquasi-continuous wavefiber

Pulsed laser source - VLM/VLR - IPG Photonics Corporation - nanosecond / quasi-continuous wave / fiber
Pulsed laser source - VLM/VLR - IPG Photonics Corporation - nanosecond / quasi-continuous wave / fiber
Pulsed laser source - VLM/VLR - IPG Photonics Corporation - nanosecond / quasi-continuous wave / fiber - image - 2
Pulsed laser source - VLM/VLR - IPG Photonics Corporation - nanosecond / quasi-continuous wave / fiber - image - 3
Pulsed laser source - VLM/VLR - IPG Photonics Corporation - nanosecond / quasi-continuous wave / fiber - image - 4
Pulsed laser source - VLM/VLR - IPG Photonics Corporation - nanosecond / quasi-continuous wave / fiber - image - 5
Pulsed laser source - VLM/VLR - IPG Photonics Corporation - nanosecond / quasi-continuous wave / fiber - image - 6
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Characteristics

Operational mode
pulsed, nanosecond, quasi-continuous wave
Technology
fiber
Spectrum
visible, green, adjustable wavelength
Applications
marking, drilling, for micro-machining, for medical applications, R&D
Other characteristics
high-power, air-cooled, water-cooled
Power

30 W, 50 W, 75 W, 100 W, 1,000 W

Wavelength

Max.: 642 nm

Min.: 517 nm

Description

Overview
Utilizing laser pulses measured in billionths of a second, green and visible wavelength nanosecond fiber lasers provide precise material interaction for microprocessing and non-metal applications. IPG fiber laser technology delivers modular and rack-mount solutions with configurable wavelengths and pulse durations to support industrial integration and production needs.

Applications
  • High-speed micromachining and precision cutting of polymers, glass and ceramics
  • PCB cutting and marking, resistor trimming, scribing
  • Marking of transparent materials and delicate surfaces
  • Drilling, texturing and microstructuring of non-metal materials including silicon and OLED substrates
  • Copper additive manufacturing and laser sintering
  • Wafer and OLED annealing, solar cell processing (PERC contact opening, selective emitter)
  • Medical, scientific and advanced manufacturing applications


Product highlights
  • Wavelength coverage across green and visible: typical 517–642 nm (varies by module/model)
  • Average power scalable from low-power families up to 1 kW for quasi-CW/high-power variants
  • Pulse durations from ~1 ns up to 1000 ns depending on family; burst and QCW options available
  • High peak power with short pulse duration for reduced heat-affected zone and precise interaction
  • Modular and rack form factors with configurable pulse energy, repetition rate and wavelength


Marking & Micromachining
The short visible wavelengths and nanosecond pulses produce small heat-affected zones and efficient absorption in many non-metal materials, improving edge quality and feature resolution for marking, cutting, scribing and copper sintering processes.

Notes
Available product families include low-power pulsed (10–30 W), mid-power (50–75 W), higher-power (75–100 W), quasi-CW/high-power models and visible nanosecond modules. Some specifications are preliminary; IPG provides custom configurations on request and regional availability may vary.

Technical specifications
  • Wavelengths: typical family range 517–642 nm; example variants: 532 nm, 517 nm, 525–642 nm
  • Average power: up to 1 kW (quasi-CW/high-power models); examples: up to 30 W, up to 75 W, up to 100 W, up to 50 W (visible modules)
  • Pulse duration: down to ~1 ns (select models); example ranges 1.5 ns, 1–200 ns, 20–1000 ns, ~1.2 ns, 4.5 ns
  • Pulse energy: examples by family — ~18 μJ single pulse (up to 70 μJ burst) for low-power; 50–700 μJ mid-power; 100–500 μJ higher-power; up to a few μJ for certain high-rep/quasi-CW modules
  • Repetition rate: ranges from 10 kHz to several MHz (examples 10–3500 kHz; QCW up to ~25–250 MHz; some visible modules >10 MHz)
  • Beam quality: M2 <1.2 for several pulsed models; <1.6 for some mid-power models; BPP <6 mm·mrad for specified visible modules
  • Cooling: air-cooled for many pulsed modules; air or water cooling for some models; higher-power/quasi-CW typically water-cooled
  • Form factors: modules and rack systems; configurable parameters for integration and production

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