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... Overview
R6055XNJ2 is a 600V Super Junction N‑channel power
MOSFET optimized for high‑speed switching applications. It combines low on‑resistance and fast switching in a compact TOLL surface‑mount package with good thermal performance ...
ROHM Semiconductor
... Overview
This SiC
MOSFET in a TSC3PAK surface-mount package features top-side heat dissipation, delivering through-hole comparable thermal performance while enabling automated SMD mounting. ROHM's proprietary trench groove ensures ...
ROHM Semiconductor
... Overview
This SiC
MOSFET in a TSC3PAK surface-mount package provides low ON-resistance and high-speed switching for high-voltage power conversion. The package uses a top-side heat dissipation structure to enable automated PCB ...
ROHM Semiconductor
... Overview
This device is a SiC
MOSFET in a TSC3PAK surface-mount package with a top-side heat dissipation structure. The package places the thermal dissipation surface on the top of the package, providing heat dissipation performance ...
ROHM Semiconductor
... Overview
This SiC
MOSFET is supplied in a TSC3PAK surface-mount package with a top-side heat-dissipation surface, enabling automated assembly while delivering thermal performance comparable to TO-247-4L through-hole packages. ...
ROHM Semiconductor
... Overview
This is a Silicon Carbide (SiC)
MOSFET in a TSC3PAK surface-mount package featuring a top-side heat dissipation structure. The top heat sink surface provides thermal performance comparable to conventional through-hole ...
ROHM Semiconductor
... Product overview
This SiC
MOSFET in the TSC3PAK package features a top-side heat dissipation surface that delivers thermal performance comparable to through-hole packages while remaining surface-mount compatible. ROHM's proprietary ...
ROHM Semiconductor
... Overview
This product is a SiC
MOSFET in the TSC3PAK surface-mount package featuring a top-side heat dissipation surface. The top-side heat dissipation enables automated mounting while delivering thermal performance comparable ...
ROHM Semiconductor
... Overview
The SCT4036DTW is a SiC
MOSFET in a TSC3PAK surface-mount package featuring top-side heat dissipation. The top heat-dissipation surface enables automated SMD mounting while delivering thermal performance comparable ...
ROHM Semiconductor
... Overview
This is a SiC
MOSFET in the TSC3PAK package featuring a top-side heat dissipation structure. The TSC3PAK delivers thermal performance approaching conventional through-hole packages while enabling automated surface-mount ...
ROHM Semiconductor
... EliteSiC Silicon Carbide (SiC) MOSFETs in bare die format - optimized for use in high power applications such as EV Traction inverters, DC-DC converters, and off-board chargers. Based on the latest generation of SiC MOSFET ...
... mSiC® MOSFETs enable higher switching frequencies and improved device efficiency to reduce component size, support higher blocking voltages and deliver strong avalanche capability. Designed for medium- to high-voltage power systems, mSiC® ...
... The CENTRAL SEMICONDUCTOR CDM2205-800FP is an 800 volt N-Channel MOSFET designed for high voltage, fast switching applications such as Power Factor Correction (PFC), lighting and power inverters. This MOSFET ...
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