Flip-chip die bonder Esec 2100 hSi

epoxyautomatedfor the semiconductor industry

The new Esec 2100 hSi with its new Dual Dispensing Module enables an unmatched productivity and process quality. Process Accuracy is further improved with the new High Precision Bond Head as well as the High Resolution Vision Systems, which now also includes an Up Looking System. The Dispense Volume Control and the Low Contrast Kit bring process control to a yet unseen level. Last but not least, the Esec 2100 hSi introduces auto-optimizing pick up tool offset and dispense pressure after syringe change. Intelligence in Productivity •Superior and proven 'light & rigid' P&P design •High Performance P&P Y-axis with Liquid Cooling System •Dual Dispensing Module with independent writing axes •Dual 5 bar Pneumatic Dispense System Controller •High Performance 4th Generation Vision System •High Speed Production Mode with excellent accuracy Intelligence in Accuracy •High Resolution 4 Megapixel Vision Systems •New High Resolution Up Looking Vision System •High Precision Bond Head with highly accurate Theta-axis •High Accuracy closed loop P&P Z-axis •High Accuracy Production Modes Intelligence in Process Control •Low Contrast Object detection vision capability •Three Dual Color Light Sources per camera •Full High Definition (FHD) Graphical User Interface with multiple camera inspection images and viewers •Sensor status overview of vacuum, air pressure and temperatures. Intelligence in Automation •Auto Adjusting Pick Up Tool offsets •Auto Adjusting Dispense Pressure after syringe change •Constant dispensing with Dispense Volume Control •Auto Adjusting 2nd System on Dual Dispense Module •Position Auto Correction of Die and Epoxy Placements