Epoxy die bonder Esec 2100 sD advanced i

fully-automaticfor the semiconductor industryhigh-accuracy

The new Esec 2100 sD advanced i with its new Device Height Sensor and High Precision Bond Head enables unmatched process capability also including High BLT applications. Process Accuracy is further improved with the High Resolution Vision Systems, which now also includes an Up Looking System while the Dual Dispensing Module brings productivity to an unmatched level for high speed applications. The Dispense Volume Control and the Low Contrast Kit bring Process Control to a yet unseen level. Last but not least, the Esec 2100 sD advanced i introduces auto-optimizing tool offsets and dispense pressure after syringe change. Intelligence in Accuracy •Device Height Sensor for extreme Z-Height Control •High Precision Bond Head with highly accurate Theta-axis •High accuracy closed loop P&P Z-axis •High Resolution 4 Megapixel Vision Systems •New High Resolution Up Looking Vision System •High Accuracy Production Modes Intelligence in Process Control •Low Contrast Object detection vision capability •Three Dual Color Light Sources per camera •Full High Definition (FHD) Graphical User Interface with multiple camera inspection images and Viewers •Sensor status overview of vacuum, air pressure and temperatures. Intelligence in Productivity •Dual Dispensing Module with independent writing axes •Dual 5 bar Pneumatic Dispense System Controller •Superior and proven “light & rigid” P&P design •High Performance P&P Y-axis with Liquid Cooling System •High Performance 4th Generation Vision System •High Speed Production Mode with excellent accuracy Intelligence in Automation •Automated Bond Head Tilt Adjustment •Auto Adjusting Pick Up Tool and Capillary offsets