The Esec 2100 hS ix is the latest member of the 2100 i Die Bonder family. It is optimized for highest speed and scratch-free transport thanks to the easy-to-use motorized and programmable rail strip handler.
The Esec 2100 hS ix also incorporates the proven features of the 2100 i generation, such as the High Resolution Vision Systems and the Dual Dispensing Module. The Esec 2100 hS ix is the new generation High Speed Die Bonder providing now the best Cost of Ownership (CoO).
New Generation Designs
High Resolution 4mega pixel Vision Systems
Motorized and Programmable Rail Strip Handler with three clamps, optimized for scratch free production
New reliable Strip push out to Magazine by Clamp
New Dual Universal Top Stack and Magazine Input Handler
New All-in-One Expansion unit for all frame sizes
Optimized Productivity
Motorized Rail Strip Handler allowing working position as close to Wafer as possible
Superior and proven P&P design with High Performance P&P Y-axis and speed optimized trajectories
Speed Optimized Soft Pick and Bond Processes
Dual 5bar Pneumatic Dispense System with independent writing axis and pressure control
Optimized Process Control
High Accuracy Production Modes
Low Contrast Object detection vision capability
Up to three calibrated Dual Color Light Sources per camera
Full High Definition (FHD) Graphical User Interface with multiple camera inspection images and Viewers
New Generation Options
Speed optimized Pneumatic Downholder System
High Precision Bond Head with highly accurate Theta Axis
High Accuracy closed loop P&P Z Axis
New High Resolution Up looking Vision System
Automatic Tool Setups and Optimization