Product overviewThe onion peeling and root cutting machine is an automated vegetable processing unit combining high-speed peeling and precision root cutting to prepare onions for downstream processing.
Use caseEngineered for commercial and industrial food-processing lines, the unit automates removal of dry outer skins and trims root and stem ends to enable continuous, high-throughput production while preserving onion integrity.
Key features- Compressed air — removes dry skin without mechanical cutting
- High-speed peeling system — minimal waste and controlled skin removal
- Automatic feeding & discharge — supports continuous line operation
Variants and configurationsAvailable as integrated peeler models with optional root-cutting units and automated material-handling configurations for industrial-scale plants.
FL-YQ-2 Onion Root Cutting Machine — briefThe FL-YQ-2 is a dedicated root-cutting module designed to trim both root and stem ends with consistent positioning and cutting accuracy for high-throughput lines.
Working principle- Feeding system: Onions are fed via hopper or conveyor to individual processing stations
- Peeling section: High-pressure air jets or rotating rollers loosen and remove outer dry skins
- Root cutting system: Precision blades cut root and tail ends automatically
- Sorting and discharge: Processed onions are transferred to conveyor for further handling or packaging
Technical parameters- Peeler model: FL-YB-3
- Peeler dimensions: 2.37 m × 1.20 m × 1.77 m
- Peeler power supply: 380V, 50Hz
- Air supply (peeler): ≥1.0 MPa
- Peeler power: 1.15 kW
- Peeler output: 2000–2500 kg/hour (onions 60–100 mm diameter)
- Peeler weight: 340 kg
- Root cutter model: FL-YQ-2
- Root cutter capacity: 90–100 pieces/minute
- Root cutter motor power: 2.22 kW
- Root cutter voltage: 220V, 60Hz
Additional information- Fully automated process reduces manual handling and improves line consistency
- Suitable for commercial and industrial food-processing installations
- Designed to minimize product damage and reduce waste during peeling