Scanning electron microscope SU9600
for thin-film measurementsfor researchfor materials research

Scanning electron microscope - SU9600 - Hitachi High-Tech Europe GmbH - for thin-film measurements / for research / for materials research
Scanning electron microscope - SU9600 - Hitachi High-Tech Europe GmbH - for thin-film measurements / for research / for materials research
Scanning electron microscope - SU9600 - Hitachi High-Tech Europe GmbH - for thin-film measurements / for research / for materials research - image - 2
Scanning electron microscope - SU9600 - Hitachi High-Tech Europe GmbH - for thin-film measurements / for research / for materials research - image - 3
Scanning electron microscope - SU9600 - Hitachi High-Tech Europe GmbH - for thin-film measurements / for research / for materials research - image - 4
Scanning electron microscope - SU9600 - Hitachi High-Tech Europe GmbH - for thin-film measurements / for research / for materials research - image - 5
Scanning electron microscope - SU9600 - Hitachi High-Tech Europe GmbH - for thin-film measurements / for research / for materials research - image - 6
Scanning electron microscope - SU9600 - Hitachi High-Tech Europe GmbH - for thin-film measurements / for research / for materials research - image - 7
Scanning electron microscope - SU9600 - Hitachi High-Tech Europe GmbH - for thin-film measurements / for research / for materials research - image - 8
Scanning electron microscope - SU9600 - Hitachi High-Tech Europe GmbH - for thin-film measurements / for research / for materials research - image - 9
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Characteristics

Type
scanning electron
Technical applications
for research, for thin-film measurements, for materials research, for materials analysis, for semiconductors
Observation technique
BF-STEM, DF-STEM, atomic number contrast
Electron source
cold field emission
Lens design
immersion
Detector type
silicon drift detector, energy-dispersive X-ray detector
Other characteristics
high-resolution, correlative, with tilt observation, ultra-high resolution
Resolution

0.2 nm, 0.34 nm, 1 nm

Description

Overview
The SU9600 (T)SEM is a modular hybrid scanning electron microscope combining ultra-high-resolution SEM and analytical STEM with a TEM-compatible sample stage. It enables correlative surface and transmitted-electron analysis in one high-stability platform, supporting UHR-SEM, STEM, 4D-STEM*, EELS* and nano-EDS* for rapid high-resolution imaging and multi-modal material characterization.

Key highlights
  • Integrated UHR-SEM and analytical STEM capabilities on a single stable platform
  • Ultra-high-resolution imaging from 10 V to 30 kV for surface and structural analysis
  • Cold field emission gun, full-immersion objective lens and TEM sample stage (0.34 nm guaranteed @ 30 kV; ~0.2 nm achievable)

Features and benefits
  • Comprehensive reflected and transmitted electron detection with energy and angular filtering
  • Correlation of SE/BSE surface contrast with BF/ADF/STEM imaging and spectral data (EELS/EDS)
  • Sub-nanometer elemental analysis using a high solid-angle windowless EDS detector
  • Access to advanced material-property measurements via EELS and 4D-STEM

Technical feature details
  • Next-generation cold field emission with NEG for high brightness and reduced chromatic aberration (EELS option)
  • Full-immersion objective lens combined with a TEM-like stage for optimal resolution and mechanical stability
  • High-resolution imaging across 0.5–30 kV (0.34 nm guaranteed @ 30 kV; ~0.2 nm achievable)
  • TEM stage and double-tilt holder for rapid cross-section orientation and zone-axis alignment (optional)
  • Compatibility with cryo holders and MEMS holders (optional)

Analytical capabilities
  • Sub-nanometer EDS with a high solid-angle windowless detector for fast nanoscale elemental mapping
  • 4D-STEM with fast direct-electron detection enabling DPC, ptychography, strain and phase mapping; virtual apertures generate BF/DF/selected-area diffraction images
  • EELS at low kV: live elemental imaging, core-loss and plasmon-loss spectroscopy with ~0.35 eV energy resolution using cold FEG

Applications
  • Nanomaterials: elemental distribution mapping, nanowire composition, lattice imaging
  • Thin films: surface morphology and grain-structure analysis
  • Elemental analysis: nanoscale composition and mapping (e.g., Ag/Cu systems)
  • Semiconductors: atomic-scale lattice imaging and diffraction analysis

Specifications
SE image resolution: 0.4 nm @ 30 kV; 1.0 nm @ 1 kV; 0.6 nm @ landing 1 kV (with optional deceleration holder and top detector)
STEM image resolution: 0.34 nm @ 30 kV (lattice imaging, option)
Accelerating voltage: 0.5 to 30 kV
Landing voltage: 0.01 to 20 kV
Electrical image shift: Up to ±5 mm (specimen height = 0.0 mm)
Stage traverse: X: ±4.0 mm, Y: ±2.0 mm, Z: ±0.3 mm, T: ±40°
Specimen size - flat specimen stage: 5.0 mm × 9.5 mm × 3.5 mm (H) max
Specimen size - cross section specimen stage: 2.0 mm × 6.5 mm × 5.0 mm (H) max

Notes
* Optional where indicated. Features such as 4D-STEM, EELS and certain holders may be optional depending on configuration.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.