Tungsten cathodic sputtering target

tungsten

Presentation These tungsten‑nickel (W–Ni) sputter targets are designed for the production of electrochromic layers used in smart glass. They are intended for reactive sputtering to form tungsten oxide and tungsten‑alloy oxide films that are transparent in the resting state and turn blue under applied DC voltage. Doping the tungsten oxide with elements such as Ni, Mo, Ti or Ta enables tuning of resistivity, switching time and optical properties of the electrochromic layer.

Key benefits

• High purity: > 99.97 % (3N7)
• Homogeneous microstructure and chemical composition
• Adjustable alloy (Ni) content to specification

Limits of traditional targets and consequences
Targets produced by conventional thermal spraying or casting often show uneven nickel distribution and material densities typically < 95 % of theoretical density. Uneven Ni distribution can create free, ferromagnetic Ni regions that cause non‑uniform sputter rates and compositional variations in the deposited films. Lower density also limits the usable thickness of a target, increasing replacement frequency in production.

Our solution and technical advantages
We manufacture W–Ni targets by powder metallurgy (complete in‑house process from powder to finished product) to achieve a homogeneous microstructure and high density (> 95 % of theoretical). This allows fabrication of sputter targets usable up to 18 mm thickness, improving target durability and lifetime in coating processes and reducing replacement frequency.

Microstructure and nickel distribution
Optical micrographs show pure tungsten (dark grey) embedded in a homogeneous tungsten‑nickel matrix. No free nickel or ferromagnetic phases are detected. Nickel content is distributed very uniformly, with fluctuations limited to ±0.5 wt% around the target value.

Table – Main properties of our tungsten‑nickel targets
Density (at 20 °C): ≥ 95 % of theoretical density
Purity: > 99.97 % wt (3N7)
Homogeneity of Ni distribution: < ±0.5 wt%
Nickel content: 25 to 55 wt% (configurable)
Microstructure: fine, uniform grain

Technical characteristics / specifications

• Composition: tungsten‑nickel alloy (W–Ni), typical Ni content 25–55 wt%
• Material purity: > 99.97 % (3N7)
• Density (20 °C): ≥ 95 % of theoretical density
• Microstructure: fine and homogeneous grain; absence of free nickel/ferromagnetic phases
• Ni homogeneity: variation ≤ ±0.5 wt% around target value
• Manufacturing process: powder metallurgy, full in‑house control from powder to finished target
• Recommended usable thickness: up to 18 mm (dense material)
• Production advantages: stable sputter rate, uniform film composition, extended target lifetime