Chromium-plated sputtering target

niobiumtantalumzirconium

Overview
Plansee manufactures sputtering targets and arc cathodes in metallic and ceramic materials (Mo, W, Cr, Ti, Al and alloys). Products are designed for microelectronics, display, photovoltaics, tool and decorative coatings. Production relies on powder metallurgy and process control to deliver defined microstructure, high purity and reproducible deposition behaviour.

Key highlights

• Material purity up to > 99.999%
• Homogeneous microstructure for uniform layers
• Integrated supply chain from raw material to finished target
• Custom compositions and functional alloys
• Recyclable materials with take-back schemes

Typical applications

• Semiconductors & microelectronics: conductor tracks, barrier layers
• Display technology (TFT, OLED, µ‑LED): conductive/reflective and antireflection layers
• Photovoltaics: back contacts and adhesion/barrier layers
• Tool and hard coatings: TiAl, AlCr, TiSi, TiB2, WC
• Mechanical and vehicle components: friction reduction, corrosion protection, thermal stability
• Decorative and optical coatings: coloured, scratch‑resistant and optical layers

Materials & alloys (at a glance)

• Molybdenum (Mo): >99.99% purity, high density — displays, solar cells, semiconductors
• Tungsten (W): up to 5N purity, very high melting point — high‑temperature and microelectronic uses
• Mo‑Ag, Mo‑Cu: high thermal conductivity — low‑friction and decorative layers
• WC, Cr, Ta, Ti and tailored blends for tribological, mechanical and thermal requirements

Alloy options and custom compositions
Plansee develops Mo‑Ag, Mo‑Cu, Al‑Cr, Cr‑B, Cr‑Si, Ti‑Zr, Mo‑Na and other bespoke blends to integrate functions such as self‑lubrication, self‑hardening or enhanced thermal behaviour.

Formats & dimensions

• Planar single‑part targets: series production up to 1.8 × 2.3 m
• Multi‑part planar sets: individual part lengths up to 3.5 m
• Rotary (tubular) targets: up to 4000 mm length
• Semiconductor targets: diameters up to 450 mm
• Hard‑coating single‑part targets: up to 250 × 300 mm

Manufacturing & quality

• Powder metallurgy with strict control of composition, grain size, density and purity
• Microstructure engineering for uniform sputtering and reproducible layers
• Internal production enables integrated functionalisation and quality assurance

Technical specifications

• Material purity: typical grades up to > 99.999% depending on material
• Planar max size: up to 1.8 × 2.3 m (single part)
• Rotary max length: up to 4000 mm
• Semiconductor diameters: up to 450 mm
• Typical alloy options: Mo‑Ag, Mo‑Cu, Mo‑Nb, Mo‑Ta, WTi, Ti‑Al, Ti‑Si, Ti‑B2, Al‑Cr, Cr, WC, Ta