OverviewMolybdenum‑tantalum (MoTa) sputtering targets combine molybdenum's adhesion to glass and high electrical conductivity with tantalum's enhanced chemical resistance. They are intended for electrode and other functional PVD layers in TFT‑LCDs and touch panels, where improved corrosion resistance and controlled wet-chemical etchability are required.
ManufacturingPlansee manufactures MoTa targets by powder metallurgy processes: selection of high‑purity metal powders, controlled mixing, pressing, sintering, precision forming and machining. Targets are finalized in local bonding shops and delivered ready for installation. Tantalum content is adjustable per application, up to approximately 11 wt.%.
Performance and benefits- Improved chemical and corrosion resistance for electrode and functional layers
- Excellent adhesion to glass substrates and high electrical conductivity
- Homogeneous microstructure and composition for consistent PVD deposition
- Good wet‑chemical etching (structuring) behavior
- Manufacturing optimized to minimize particle formation and arcing during PVD
Center of expertise & developmentCoating materials and process parameters are developed and validated in Plansee's PVD application laboratory under industrially relevant conditions. Collaboration with customers and equipment suppliers enables rapid material qualification and application‑specific tuning.
Raw materials & supplyPlansee controls the full value chain from certified, conflict‑free tantalum powder to finished sputtering targets, ensuring traceability and reliable supply. Quality control reduces metallic and non‑metallic impurities to limit particle generation.
Technical characteristics / specifications- Purity: ≥ 99.97% (metal basis)
- Target density: > 98% (relative density)
- Tantalum content: application‑dependent, up to ~11 wt.%
- Manufacturing: powder metallurgy (mixing, pressing, sintering, forming, machining, bonding)
- Intended use: electrode layers in TFT‑LCD, touch panels and other PVD‑coated functional layers
- Key properties: excellent glass adhesion, high electrical conductivity, improved chemical resistance, homogeneous deposition rates, reduced particle formation