Molybdenum base plate

nickelgoldtungsten

Overview
Base plates manufactured from molybdenum (Mo) and tungsten (W) provide a thermally compatible substrate for power diodes, thyristors and transistors. Similar coefficients of thermal expansion reduce mechanical stress between semiconductor and carrier, while high material purity ensures reliable thermal conductivity.

Your advantages at a glance

• Custom designs to specification (round, square, rectangular, special depths)
• Coating options: ultrapure PVD or electroplated finishes
• Customer-specific clean-room packaging after coating
• Support from prototype to series production – in-house capabilities

Thermal compatibility and reliability
Matching thermal expansion coefficients minimizes mechanical tension during thermal cycling, extending module lifetime. Ultrapure PVD coatings deliver homogeneous layers; electroplating is available as an alternative depending on application requirements. In-house PVD target production and controlled coating processes ensure consistent material purity and performance.

Design flexibility
We supply base plates in various geometries (round, square, rectangular, deep/stepped) and adapt thicknesses and coatings to application needs. Prototypes and series production are supported with tailored process flows.

Quality and supply chain
Raw material sourcing from established suppliers ensures traceability and consistent feedstock quality for molybdenum and tungsten powders/oxides. Collaboration with leading processors secures supply reliability for production volumes.

Coating options

• Ruthenium (Ru)
• Nickel (Ni)
• Chromium (Cr)
• Silver (Ag)
• Gold (Au)

Typical properties (comparison)
Molybdenum (Mo) vs Tungsten (W):
Purity [%]: Mo 99.97 ; W 99.99
Thermal coefficient of expansion at 20°C [ppm/K]: Mo ≈ 5.2 ; W ≈ 4.2
Thermal conductivity at 20°C [W/(m·K)]: Mo ≈ 142 ; W ≈ 164

Typical dimensions (examples)
Molybdenum discs: Thickness: from 0.1 mm up to ≥ 7.0 mm ; Diameter: 2.5 mm up to ≥ 150.0 mm
Tungsten discs: Thickness: from 0.4 mm up to ≥ 7.0 mm ; Diameter: 2.5 mm up to ≥ 150.0 mm
Square/rectangular Mo: Thickness from 0.1 mm ≥ 5.0 mm ; Long side 1.0 mm ≥ 70.0 mm ; Short side 0.2 mm ≥ 10.0 mm
Square/rectangular W: Thickness from 0.4 mm ≥ 5.0 mm ; Long side 1.0 mm ≥ 70.0 mm ; Short side 0.2 mm ≥ 10.0 mm

Processes and services

• Raw material processing (oxide handling, alloy mixing)
• Pressing, sintering and heat treatment
• Forming and precision mechanical processing
• Surface coating (PVD and electroplating) and clean-room packaging
• Quality assurance, testing, recycling and lifecycle support

Technical specifications

• Materials: molybdenum (Mo), tungsten (W)
• Purity: Mo ≈ 99.97% ; W ≈ 99.99%
• CTE (20°C): Mo ≈ 5.2 ppm/K ; W ≈ 4.2 ppm/K
• Thermal conductivity (20°C): Mo ≈ 142 W/(m·K) ; W ≈ 164 W/(m·K)
• Coating metals: Ru, Ni, Cr, Ag, Au
• Coating processes: PVD (ultrapure) and electroplating
• Packaging: customer-specific clean-room packaging
• Production support: prototype to series, in-house PVD target manufacture and processing