Tungsten sputtering target

Overview
Tungsten layers are components of thin-film transistors in TFT-LCD screens and are used in microelectronics (e.g. layers in frequency filters such as SAW/BAW). Other applications include diffusion barriers (tungsten-nitride), conductor tracks in microelectronic components and reactively sputtered transparent layers (tungsten oxide) for OLED displays and electrochemical uses.

Your advantages at a glance

• High purity > 99.97%
• Maximum density > 99.5%
• Center of expertise for new coating solutions
• Homogeneous microstructure
• Ideal texture for specific application

How are tungsten layers produced?
During the magnetron sputtering process (PVD), metal atoms are released from the sputtering targets and condense as a thin film on the substrate. Magnetron sputtering is a cost-effective, fast coating process in which all materials must meet stringent quality criteria.

Maximum purity
Metal and non-metal impurities in the sputtering target transfer to the sputtered functional layer and can affect functionality or cause particle formation (arcing). For this reason sputtering targets must meet the highest purity requirements. Plansee guarantees tungsten targets with a minimum purity of 99.97% (3N7); typical purity is 99.99%. For semiconductor-industry applications a minimum purity of 99.999% (5N) can be guaranteed.

Highest density and homogeneous microstructure
Tungsten sputtering targets are highly compressed by special forming processes to achieve increased and homogeneous coating rates and improved coating properties in the PVD process. The manufacturing process allows targeted adjustment of the microstructure. Targets with a uniform microstructure and texture ensure consistent sputtering rates and film thickness.

Partnering to develop new coating solutions
Plansee works with system manufacturers and research institutes to develop and optimize film systems and coating materials. Development teams create film systems and analyze them in detail so that new coating materials can be developed rapidly in cooperation with customers and development partners.

Highest quality from a single source
The value-added chain for sputtering targets is covered under one roof: procurement of conflict-free raw materials, powder blanks, powder-metallurgical processes, hot rolling (planar targets), dedicated forming processes (rotary targets), machining and finalization including bonding in local bonding shops. Integration across the chain supports consistent product quality and traceability.

Product specifications
Detailed product specifications for Plansee tungsten sputtering targets are provided in the product documentation (technical specification sheet).

Caractéristiques / spécifications techniques

• Chemical purity: guaranteed minimum 99.97% (3N7); typical 99.99%; up to 99.999% (5N) available for semiconductor applications
• Bulk density: > 99.5% (maximum density)
• Microstructure: homogeneous, adjustable texture for specific application needs
• Manufacturing technologies: powder blanks, pressing/compacting, sintering, hot rolling (planar targets), rotary target forming, machining and bonding
• Intended coating methods: magnetron sputtering (PVD), reactive sputtering for tungsten oxide layers
• Typical applications: TFT-LCD thin-film transistors, SAW/BAW filter layers, diffusion barriers (W-N), conductor tracks, OLED and electrochemical tungsten-oxide layers