Tungsten cathodic sputtering target

molybdenum cathodic

Product overview
Mo‑W alloys provide improved chemical stability compared with pure molybdenum during wet etching with ITO, aluminum or copper etchants. Tungsten content is defined per application and can reach up to 50 percent by weight. Powder metallurgical production ensures a homogeneous tungsten distribution and controlled microstructure.

Your advantages

• High purity > 99.97%
• Maximum density > 99.95%
• Homogeneous microstructure and chemical composition

Applications and process capabilities
Designed for PVD sputtering applications and compatible with processes involving ITO, aluminum and copper. In‑house PVD application testing is performed under practical conditions to develop and analyse layers. Coating processes available include PVD, CVD, APS and VPS; typical coated products include semiconductor base plates and rotating X‑ray anodes.

Manufacturing and supply chain
Powder metallurgical manufacturing (mixing/alloying, pressing, sintering, hot rolling where applicable) produces planar and rotary targets as well as compact sintered semi‑finished parts. Sintering is the central step to achieve high density. After machining, targets are finalized in local bonding shops and delivered ready for installation. The raw material value chain for tungsten and molybdenum is integrated across the supply network.

Technical characteristics / specifications

• Chemical stability superior to pure molybdenum in wet‑etching environments
• Tungsten content: up to 50 percent by weight (defined per application)
• High purity: > 99.97%
• Maximum density: > 99.95%
• Powder metallurgical production ensures homogeneous W distribution
• Available in planar sputtering targets and rotary/rotating target configurations
• Key production steps: powder mixing/alloying, pressing, sintering, (hot) rolling, machining, bonding/assembly
• In‑house PVD application laboratory for coating development and layer analysis