Wire tungsten alloy

Overview
GTP Parts (Towanda, Pennsylvania) manufactures gold-plated tungsten (W) and molybdenum (Mo) wires for high-reliability industrial applications. Gold plating improves electrical contact quality, wettability for soldering, and resistance to oxidation and corrosion — properties required in electronics, medical devices, aerospace and advanced sensor systems.

Applications

• Electronics (contacts, fine interconnects)
• Medical devices and diagnostic equipment
• Aerospace, including satellite antennas and lightweight structures
• High-end sensor technology
• Printing and fine-structure manufacturing
• Soldering and contact surfaces requiring consistent wetting

Your advantages at a glance

• Improved electrical conductivity and contact performance
• Optimized for demanding soldering and assembly processes
• Enhanced oxidation and corrosion resistance
• Mechanical and thermal stability under operating conditions
• Consistent, uniform plating quality for reproducible results

Gold plated tungsten wire
Tungsten provides maximum mechanical and thermal stability with a very high melting point. Because tungsten and gold have nearly identical densities (W ≈ 19.25 g/cm³ vs Au ≈ 19.3 g/cm³), overall part density is essentially unchanged after plating — an advantage when weight and inertia matter. Coating thickness should be chosen with the application’s thermal requirements in mind.

Gold plated molybdenum wire
Molybdenum wire is lighter and more ductile than fine tungsten wire, offering superior formability for woven meshes, shaped components and delicate assemblies. It is well suited where low weight, good malleability and fine shaping are required, such as satellite antenna elements or precision medical components.

Coating and dimensions

• Coated diameters: 0.025 mm – 0.625 mm
• Gold content (plating): adjustable from 1 % to 25 %
• Standard gold-content tolerance: ± 1 %
• Coating objectives: improved conductivity, wettability, oxidation/corrosion resistance and uniform coverage

Technical specifications

• Base materials: tungsten (W) and molybdenum (Mo)
• Diameter range (coated): 0.025 mm – 0.625 mm
• Gold plating content: 1 % – 25 % (standard tolerance ±1 %)
• Typical benefits: increased electrical conductivity, superior wettability, oxidation resistance, mechanical/physical stability
• Density note: W ≈ 19.25 g/cm³; Au ≈ 19.3 g/cm³ — plating has negligible effect on bulk density
• Quality: controlled, uniform plating for high-reliability soldering and contact applications