Molybdenum alloy

Overview
Ion implantation beamline components and spare parts for semiconductor implanters, designed for high-temperature, high-purity and process-stable operation. Components are manufactured from refractory metals, engineered graphite and technical ceramics to meet OEM geometries or optimized Plansee standards.

Your advantages at a glance

• Decades of experience in semiconductor component manufacturing
• Production to OEM specifications or Plansee Advanced Standard (PAS) optimizations
• Strict material purity and dimensional control
• Global manufacturing and supply network for critical spare parts

Product properties

• High temperature resistance (service temperatures up to ~1,400 °C depending on material)
• Resistance to strong electromagnetic fields and process gases
• High material purity and controlled thicknesses to minimise particle generation
• Micron-level manufacturing precision for critical beamline geometries

Products (typical components and spare parts)

• Chambers (graphite, tungsten, molybdenum and alloys)
• Filaments and heaters (tungsten, tungsten alloys)
• MRS vanes / blades and diaphragms (graphite, tungsten, molybdenum, alloys)
• Brackets, supports and cathodes (tungsten, molybdenum, alloys)
• Terminals and analyzer parts (graphite)
• Insulators and ceramic components
• General spare parts (graphite, refractory metals, alloys, ceramics, steel)

Production and optimization

• Manufacture to exact OEM drawings or enhanced PAS versions with optimized geometries and wear zones
• Global production sites (examples: Japan, USA, Korea, China, India) to support lead-time and quality requirements
• Precision machining and strict quality inspection at each production stage

Advantages of Plansee Advanced Standard (PAS)

• Improved installation/removal and handling
• Extended component life and reduced downtime
• Lower cleaning and maintenance needs
• Geometry and material optimizations can deliver significantly longer life for critical parts (e.g. certain PAS MRS vanes)

Compatible OEMs / supported implanter families (examples)

• Applied Materials (9000, 9200, 9500, Quantum series, xR series)
• Former Varian families (VIISta, VIISion, XP/HD series)
• Axcelis (GSD / NV / Optima families)
• Nissin (NH / PR / EXCEED families)
• SEN, Ulvac and other specialized implanter manufacturers

Materials & process stability

• Materials: molybdenum, tungsten, engineered graphite grades, technical ceramics and selected alloys
• Special graphite grades minimise abrasion and particle formation to increase process stability
• Design improvements (e.g. optimized vane angles) reduce chemical and thermal wear

Technical specifications

• Maximum service temperature: up to ~1,400 °C (material-dependent)
• Materials: Mo, W, graphite, ceramics, selected alloys and steel
• Typical component types: chambers, filaments, MRS vanes/blades, brackets, cathodes, terminals, analyzer parts, insulators, spare parts
• Precision: micron-level manufacturing tolerances
• Production standards: OEM specification or PAS‑optimized parts
• Supported systems: compatible solutions for 100+ implanter models/families