Optical inspection system TR7700Q TB SII

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Introduction
The TR7700Q TB SII is a dual-sided automated optical inspection (AOI) system offering 3D top-view and 2D bottom-view inspection for high-coverage detection of THT, DiP and SMD defects. Equipped with TRI's AI-powered algorithms and metrology-grade measurements, it provides precision inspection and production data readiness for Smart Factory integration.

Features

• High-speed 3D top-view and 2D bottom-view inspection, up to 57 cm²/sec
• High defect coverage for THT/DIP assemblies
• AI-powered algorithms with smart programming tools
• Metrology-grade measurement capabilities
• Industry 4.0 / Smart Factory ready with MES connectivity

Optical System
Imaging Method: Stop-and-Go imaging
Top camera (3D): 12 Mpix; Resolution: 10 µm or 15 µm (configuration dependent)
Bottom camera (2D): 6.5 Mpix; Resolution: 10 µm or 12.5 µm (configuration dependent)
3D technology (top): Quad digital fringe projectors
Max. 3D height range: 40 mm
Lighting: Multi-phase true color LED

Imaging Performance
Max. imaging speed: 57 cm²/sec

Motion Table & Control
X axis control: Ballscrew + AC servo with motion controller
Y axis control: Ballscrew + AC servo with motion controller
Z axis control: Ballscrew + AC servo with motion controller
X-Y-Z axis resolution: 1 µm

Board Handling
Max. PCB size: 510 x 510 mm
PCB thickness: 0.5 - 6 mm
Max. PCB weight: 3 kg (optional: 5 kg)
Top clearance: 50 mm
Bottom clearance: 40 mm
Conveyor/inline height: 880 - 920 mm (optional: 940 - 965 mm) — SMEMA compatible

Inspection Functions

• Component defects: Missing; Tombstoning; Billboarding; Polarity; Rotation; Shift; Wrong marking (OCV); Defective; Upside down; Extra component; Foreign material; Lifted component
• THT defects: Missing; Position; Soldering defects; Pinhole; Blowhole; Pin height; Pin angle; Pin offset; Bridging; Wetting
• Solder joint defects: Fillet height; Solder volume %; Excess solder; Insufficient solder; Bridging; Through-hole pins; Lifted lead; Gold finger scratch/contamination

Dimensions
WxDxH: 1200 x 2020 x 2000 mm (signal tower not included; signal tower height 488 mm)
Weight: 1720 kg

Configurations & Options
Configurations: 1) Top 12 MP 10 µm / Bottom 6.5 MP 10 µm; 2) Top 12 MP 15 µm / Bottom 6.5 MP 12.5 µm.
Optional: Z-axis for bottom-up inspection; Linear encoder module; Dual ball screw + servo motor.

Smart Factory & Software
AI-powered algorithms and metrology-grade measurements for precision inspection. Smart Factory ready: supports MES connectivity and standards including IPC-CFX, IPC-DPMX and IPC-HERMES-9852.

Technical specifications

• Brand: TRI (Test Research, Inc.)
• Model: TR7700Q TB SII
• Max imaging speed: 57 cm²/sec
• Top camera: 12 Mpix (10 µm or 15 µm)
• Bottom camera: 6.5 Mpix (10 µm or 12.5 µm)
• 3D max height range: 40 mm
• 3D technology: Quad digital fringe projectors (top)
• Lighting: Multi-phase true color LED
• X-Y-Z axis resolution: 1 µm
• Max PCB size: 510 x 510 mm
• PCB thickness: 0.5 - 6 mm
• Max PCB weight: 3 kg (optional 5 kg)
• Top clearance: 50 mm; Bottom clearance: 40 mm
• Conveyor inline height: 880 - 920 mm (optional 940 - 965 mm)
• Dimensions (WxDxH): 1200 x 2020 x 2000 mm
• Weight: 1720 kg
• Supports standards: IPC-CFX, IPC-DPMX, IPC-HERMES-9852
• AI-powered inspection and metrology-grade measurements