Optical inspection system TR7700QB SII

camera3Dautomated

Introduction
The TR7700QB SII is a bottom-view 3D Automated Optical Inspection (AOI) system delivering 15 μm resolution with a 12 MP high-speed camera. Designed for high-coverage inspection of through-hole technology (THT) components and dual in-line packages (DIP), it provides metrology-grade measurements and supports smart factory data exchange for MES integration.

Features

• High-speed bottom-view 3D AOI up to 57 cm²/sec
• Smart programming for rapid process setup
• Comprehensive defect coverage for THT/DIP assemblies
• Metrology-grade inspection for precise dimensional measurements

Optical System
Imaging method: Stop-and-Go
Camera: 12 MP high-speed camera
Imaging resolution: 15 μm
Lighting: Multi-phase True Color LED
3D technology: Quad digital fringe projectors
Maximum 3D range: 20 mm

Inspection Performance
Maximum imaging speed: up to 57 cm²/sec (dependent on component distribution)

Motion Table & Control
X/Y/Z axis control: Ballscrew with AC servo and motion controller
X-Y axis resolution: 1 μm

Board Handling
Maximum PCB size: 510 x 510 mm
PCB thickness: 0.5 - 6 mm
Maximum PCB weight: 3 kg (optional 5 kg / 15 kg)
Top clearance: 100 mm
Bottom clearance options: 40 / 70 / 90 mm
Edge clearance: 3 mm (optional 5 mm)
Conveyor/inline height: 880 - 920 mm (optional 950 ± 20 mm)

Inspection Functions

• Component: Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong marking (OCV), Defect, Upside down, Extra component, Foreign material, Lifted component, Bridge, Pin height
• THT defects: Missing, Position, Soldering defects, Pinhole, Blowhole, Pin height, Pin angle, Pin offset, Bridging, Wetting
• Solder: Fillet height, Solder volume %, Excess solder, Insufficient solder, Bridging, Through-hole pins, Lifted lead, Golden finger scratch/contamination

Dimensions
Overall (W×D×H): 1100 x 1730 x 1585 mm (signal tower height 515 mm not included)
Weight: 1030 kg

Technical specifications

• Model: TR7700QB SII
• Imaging resolution: 15 μm
• Camera: 12 MP high-speed camera
• Imaging method: Stop-and-Go
• Lighting: Multi-phase True Color LED
• 3D technology: Quad digital fringe projectors
• Maximum 3D range: 20 mm
• Maximum imaging speed: up to 57 cm²/sec (depending on component distribution)
• X-Y axis resolution: 1 μm
• Motion control: Ballscrew + AC Servo with motion controller (X/Y/Z)
• Maximum PCB size: 510 x 510 mm
• PCB thickness range: 0.5 - 6 mm
• Maximum PCB weight: 3 kg (optional 5 kg / 15 kg)
• Top clearance: 100 mm
• Bottom clearance options: 40 / 70 / 90 mm
• Edge clearance: 3 mm (optional 5 mm)
• Inline conveyor height: 880 - 920 mm (optional 950 ± 20 mm)
• Overall dimensions (W×D×H): 1100 x 1730 x 1585 mm
• Weight: 1030 kg