CMOS inspection system TR7700QM SII

digitalcamera3D

Introduction
The TR7700QM SII is built on a high-accuracy platform with 5.5 μm resolution and a 12 MP imaging system, designed for inspection tasks in the Semiconductor & Packaging industry. This Stop-and-Go 3D AOI inspects wire bonds, die bonds, SMD, bumps and solder joints. Metrology capabilities and flexible inspection algorithms enhance measurement accuracy and defect detection.

Features

• Targeted for semiconductor and packaging technology inspection
• 5.5 μm resolution for metrology-grade inspection
• Fast setup: ready to inspect in minutes with TRI's Smart Programming
• Multiple 3D technologies for comprehensive coverage

Optical System
Imaging Method: Stop-and-Go
Top Camera: 12 MP high-speed camera
Angle Camera: N/A
Imaging Resolution: 5.5 μm
Lighting: Multi-phase True Color LED, coaxial lighting
3D Technology: Quad digital fringe projectors
Max. 3D Range: 20 mm

Inspection Performance
Imaging Speed: Up to 7.7 cm²/sec

Motion Table & Control
X-Axis Control: Ballscrew + AC servo with motion controller
Y-Axis Control: Ballscrew + AC servo with motion controller
Z-Axis Control: Ballscrew + AC servo with motion controller
X-Y Axis Resolution: 1 μm (with optional linear encoder)

Board Handling
Max PCB Size: 400 x 330 mm
PCB Thickness: 0.6 - 5 mm
Max PCB Weight: 3 kg
Top Clearance: 20 mm
Bottom Clearance: 40 mm
Edge Clearance: 3 mm (optional 5 mm)
Conveyor Height: 880 - 920 mm

Inspection Functions
Component

• Missing
• Tombstoning
• Billboarding
• Polarity
• Rotation
• Shift
• Wrong marking (OCV)
• Defective
• Upside down
• Extra component
• Foreign material
• Lifted component

Solder

• Solder fillet height
• Solder volume %
• Excess solder
• Insufficient solder
• Bridging
• Through-hole pins
• Lifted lead
• Golden finger scratch / contamination

Dimensions
WxDxH: 1000 x 1460 x 1650 mm
Note: dimensions exclude signal tower; signal tower height 515 mm
Weight: 785 kg

Technical specifications

• Model: TR7700QM SII
• Imaging Resolution: 5.5 μm
• Top Camera: 12 MP high-speed camera
• Imaging Method: Stop-and-Go
• 3D Technology: Quad digital fringe projectors
• Max. 3D Range: 20 mm
• Lighting: Multi-phase True Color LED, coaxial lighting
• Imaging Speed: Up to 7.7 cm²/sec
• X-Y Axis Resolution: 1 μm (with optional linear encoder)
• Motion Control: Ballscrew + AC servo with motion controller (X/Y/Z)
• Max PCB Size: 400 x 330 mm
• PCB Thickness: 0.6 - 5 mm
• Max PCB Weight: 3 kg
• Top / Bottom Clearance: 20 mm / 40 mm
• Edge Clearance: 3 mm (optional 5 mm)
• Conveyor Height: 880 - 920 mm
• Overall Dimensions (WxDxH): 1000 x 1460 x 1650 mm
• Weight: 785 kg