Optical inspection system TR7700 SIII DT

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INTRODUCTION
TR7700 SIII DT is a desktop AOI inspection system for precise pre- and post-reflow inspection of PCBs. It uses TRI's multi‑phase RGB+W LED lighting and next‑generation inspection software to enable fast programming for frequently changing production and to minimize false calls with advanced algorithms.

KEY FEATURES

• Desktop AOI solution for pre- and post-reflow PCB inspection
• Quick and intuitive programming with IPC standard compliance
• Multi‑phase RGB+W LED lighting combined with advanced algorithms to reduce false calls
• Available in standard and L variants for different PCB sizes

OPTICAL SYSTEM (AOI)
Imaging Method: Dynamic Imaging
Top Camera: 4 Mpix
Imaging Resolution: 10 µm, 15 µm (factory setting)
Lighting: Multi‑phase RGB+W LED
3D Technology: N/A

INSPECTION PERFORMANCE
Imaging Speed: 4 Mpix @ 10 µm: 60 cm²/sec
4 Mpix @ 12.5 µm: 120 cm²/sec

MOTION TABLE & CONTROL
X-Axis Control: Ballscrew + AC-servo controller
Y-Axis Control: Ballscrew + AC-servo controller
Z-Axis Control: N/A
X-Y Axis Resolution: 1 µm

BOARD HANDLING
Max PCB Size: TR7700 SIII DT: 330 x 250 mm
TR7700L SIII DT: 510 x 460 mm
PCB Thickness: up to 3 mm
Max PCB Weight: 3 kg
Top Clearance: 25 mm (48 mm optional)
Bottom Clearance: TR7700 SIII DT: 100 mm; TR7700L SIII DT: 50 mm
Edge Clearance: 3 mm
Conveyor: Manual

INSPECTION FUNCTIONS

• Component checks: missing, tombstoning, billboarding, polarity, rotation, shift, wrong marking (OCV), defective, upside down, extra component, foreign material
• Solder checks: excess solder, insufficient solder, bridging, through-hole pins, lifted lead, golden finger, scratch/contamination

DIMENSIONS & WEIGHT
WxDxH: TR7700 SIII DT: 860 x 1100 x 1350 mm; TR7700L SIII DT: 980 x 1345 x 1490 mm
Weight: TR7700 SIII DT: 340 kg; TR7700L SIII DT: 385 kg

ADDITIONAL INFORMATION
Top camera resolution: 4 Mpix. Factory imaging resolution options: 10 µm and 15 µm. Multi‑phase RGB+W LED supports multi‑phase inspection workflows. System targets rapid programming for frequently changing production lines and minimizes false calls via advanced image processing algorithms. Optional configurations available for extended top clearance and larger PCB handling.

TECHNICAL SPECIFICATIONS

• Model: TR7700 SIII DT (standard), TR7700L SIII DT (L variant)
• Imaging Method: Dynamic Imaging
• Top Camera: 4 Mpix
• Imaging Resolution: 10 µm, 15 µm (factory setting)
• Lighting: Multi‑phase RGB+W LED
• Imaging Speed: 60 cm²/sec @ 10 µm; 120 cm²/sec @ 12.5 µm
• X-Y Axis Resolution: 1 µm
• Motion Control: Ballscrew + AC‑servo controller (X, Y)
• Max PCB Size: 330 x 250 mm (standard); 510 x 460 mm (L variant)
• PCB Thickness: up to 3 mm
• Max PCB Weight: 3 kg
• Top Clearance: 25 mm (48 mm optional)
• Bottom Clearance: 100 mm (standard model)
• Edge Clearance: 3 mm
• Conveyor: Manual
• Dimensions (WxDxH): 860 x 1100 x 1350 mm (standard)
• Weight: 340 kg (standard)
• Video: Product overview video available