Optical inspection system TR7700 SIII Ultra

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Introduction
The TR7700 SIII Ultra is a high-volume Automated Optical Inspection (AOI) system designed for inline PCB inspection. Built on an enhanced mechanical platform, it supports Industry 4.0 protocols including IPC-CFX, IPC-Hermes-9852 and IPC-DPMX.

Key features

• Inspection speed up to 120 cm²/sec (configuration dependent)
• Fast setup with TRI Smart Programming for reduced changeover time
• Metrology-grade accuracy for component and solder measurements
• Enhanced mechanical stability with ballscrew + AC servo motion control (X/Y/Z)
• Closed-loop manufacturing ready with feedback/feedforward capabilities
• Smart factory integration with real-time SPC and traceability

Optical system
Imaging method: Dynamic Imaging
Top camera options: 4 MP / 9 MP / 12 MP high-speed color cameras
Imaging resolutions (factory settings): 5.5 µm, 6 µm, 10 µm, 15 µm
Lighting: Multi-phase RGB+W LED
3D technology: 3D laser sensor (standard on 3D models)

Inspection performance
Imaging speed examples by camera/resolution:
4 MP @ 10 µm: up to 60 cm²/sec
4 MP @ 15 µm: up to 120 cm²/sec
9 MP @ 10 µm: up to 80 cm²/sec
12 MP @ 5.5 µm: up to 32 cm²/sec
12 MP @ 6 µm: up to 37 cm²/sec

Motion table & control
X/Y/Z axis: Ballscrew + AC servo with motion controller
X-Y axis resolution: 1 µm
Z-axis resolution: (not specified)

Board handling
Max PCB size variants: TR7700 SIII Ultra (3D): 510 x 460 mm; TR7700M SIII Ultra: 660 x 690 mm; TR7700 SIII Ultra (3D) DL: 510 x 310 mm x 2 lanes or 510 x 590 mm x 1 lane
PCB thickness: 0.6–5 mm
Max PCB weight: standard 3 kg (optional 5 kg / 12 kg)
Top clearance: 25 mm (optional 48 mm)
Bottom clearance: 40 mm
Edge clearance: 3 mm (optional 4 mm / 5 mm)
Conveyor inline height: 880–920 mm (optional SMEMA compatible 940–965 mm)

Inspection functions

• Component defects: missing, tombstoning, billboarding, polarity, rotation, shift, incorrect marking (OCV), defective, upside down, extra component, foreign material
• Solder defects: excess solder, insufficient solder, bridging, through-hole pins, lifted lead, golden finger issues, scratches/contamination

Dimensions & weight
WxDxH variants: TR7700 SIII Ultra (3D): 1100 x 1720 x 1710 mm; TR7700M SIII Ultra: 1250 x 1888 x 1710 mm; TR7700 SIII Ultra (3D) DL: 1100 x 1820 x 1710 mm (excluding signal tower)
Weight: TR7700 SIII Ultra (3D): 940 kg; TR7700M SIII Ultra: 992 kg; TR7700 SIII Ultra (3D) DL: 960 kg

Technical specifications

• Model: TR7700 SIII Ultra
• Imaging method: Dynamic Imaging
• Top camera options: 4 MP / 9 MP / 12 MP high-speed color camera
• Available imaging resolutions: 5.5 µm, 6 µm, 10 µm, 15 µm (factory set)
• Lighting: Multi-phase RGB+W LED
• 3D sensor: 3D laser sensor (standard for 3D models)
• Maximum reported inspection speed: up to 120 cm²/sec (4 MP @ 15 µm)
• X-Y axis resolution: 1 µm
• Motion control: Ballscrew + AC servo with motion controller (X/Y/Z)
• Max PCB size variants and DL configurations as listed above
• PCB thickness range: 0.6–5 mm
• Max PCB weight: standard 3 kg (optional 5 kg / 12 kg)
• Top clearance: 25 mm (optional 48 mm)
• Bottom clearance: 40 mm
• Edge clearance: 3 mm (optional 4 mm / 5 mm)
• Conveyor inline height: 880–920 mm (optional SMEMA compatible 940–965 mm)