Optical inspection machine TR7500QE Plus

3DPCBfor the electronics industry

Introduction
The TR7500QE Plus is the next-generation multi-camera side-view 3D AOI for PCB inspection. The cost-effective 3D AOI platform integrates AI-powered algorithms and enhanced mechanical capabilities to provide high-accuracy inspection. Side-view cameras enable detection of inner-layer bridges, hidden lifted leads and other out-of-sight defects. The TR7500QE Plus supports current Smart Factory standards including IPC-CFX and the Hermes Standard (IPC-HERMES-9852).

Features

• Multi-angle 3D side view with 5-camera inspection
• Metrology-grade measurements
• AI-powered algorithms with smart programming
• Industry 4.0 ready platform

Optical System
Imaging Method: Stop-and-Go
Top Camera: 12 MP high-speed camera
Angle Cameras: 4 angled cameras (side view)
Imaging Resolution: 10 µm, 12 µm*, 15 µm (factory setting) * Available for TR7500QE Plus
Lighting: Multi-phase true color LED, coaxial lighting
3D Technology: Digital fringe pattern projectors
Max. 3D Range: 40 mm

Inspection Performance
Imaging Speed: @10 µm: 25 cm²/sec; @12 µm: 37 cm²/sec; @15 µm: 57 cm²/sec

Motion Table & Control
X-Axis Control: Ballscrew + AC servo with motion controller (linear motor optional)
Y-Axis Control: Dual-driven ballscrew + AC servo with motion controller
Z-Axis Control: Ballscrew + AC servo with motion controller
X-Y Axis Resolution: 1 µm

Board Handling
Max PCB Size: TR7500QE Plus: 510 x 510 mm; TR7500QE Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane; TR7500L QE Plus: 765 x 610 mm
PCB Thickness: 0.5 - 6 mm
Max PCB Weight: 3 kg (option: 4 kg / 5 kg)
Top Clearance: 50 mm
Bottom Clearance: 40 mm
Edge Clearance: 3 mm (optional: 4 mm / 5 mm)
Conveyor Height: Inline height: 880 – 920 mm (optional: 940–965 mm SMEMA compatible)

Inspection Functions
Component defects detected: Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong marking (OCV), Defective, Upside down, Extra component, Foreign material
Solder inspection: Solder fillet height, Solder volume %, Excess solder, Insufficient solder, Bridging, Through-hole pins, Lifted lead, Golden finger scratch/contamination

Dimensions
WxDxH: TR7500QE Plus: 1100 x 1730 x 1700 mm; TR7500QE Plus DL: 1100 x 2005 x 1700 mm; TR7500L QE Plus: 1365 x 1865 x 1700 mm (note: not including signal tower; signal tower height 520 mm)
Weight: TR7500QE Plus: 920 kg; TR7500QE Plus DL: 1040 kg; TR7500L QE Plus: 1035 kg

Specifications

• Model: TR7500QE Plus
• Imaging Method: Stop-and-Go
• Top Camera: 12 MP high-speed camera
• Angle Cameras: 4 angled cameras (side view)
• Imaging Resolution options: 10 µm / 12 µm / 15 µm
• Lighting: Multi-phase true color LED, coaxial lighting
• 3D Technology: Digital fringe pattern projectors
• Max. 3D Range: 40 mm
• Imaging Speed: 25 / 37 / 57 cm²/sec (@10/12/15 µm)
• X-Y Axis Resolution: 1 µm
• Motion Control: Ballscrew + AC servo (linear motor optional); dual-driven ballscrew for Y axis
• Max PCB Size (standard): 510 x 510 mm
• PCB Thickness: 0.5 - 6 mm
• Max PCB Weight: 3 kg (optional 4 kg / 5 kg)
• Clearances: Top 50 mm, Bottom 40 mm, Edge 3 mm (optional 4 / 5 mm)
• Conveyor Height: 880 – 920 mm (optional 940–965 mm SMEMA compatible)
• Dimensions (WxDxH): 1100 x 1730 x 1700 mm (standard model)
• Weight: 920 kg (standard model)
• Standards: IPC-CFX, IPC-HERMES-9852