Optical inspection system TR7700QC SII

video visioncamera3D

Introduction
The TR7700QC SII is a 3D AOI inspection system designed for electronics manufacturing lines. It delivers essential automated optical inspection functions for component and solder verification, supports flexible IPC‑610 algorithm programming and integrates with Smart Factory environments.

Key features

• 3D AOI for components and solder joint inspection
• User-friendly programming with IPC‑610 flexible algorithms
• Inspection speed up to 57 cm²/s (depending on resolution)
• Tall component inspection with 3D height range up to 40 mm
• Multi-phase true color LED lighting and quad digital fringe projectors for accurate 3D measurement

Optical system (summary)
Imaging method: Stop-and-Go
Top camera: 12 MP high-speed camera
Imaging resolutions (factory): 10 µm / 12 µm / 15 µm
Lighting: Multi-phase True Color LED
3D technology: Quad digital fringe projectors
Max. 3D range: 40 mm

Inspection performance
Imaging speed:
@ 10 µm: 25 cm²/s
@ 12 µm: 37 cm²/s
@ 15 µm: 57 cm²/s

Motion table & control
X / Y / Z control: Ballscrew + AC servo with motion controller
X-Y axis resolution: 1 µm

Board handling
Max PCB sizes (by model):
TR7700QC SII: 510 x 460 mm
TR7700MQC SII: 660 x 690 mm
TR7700L QC SII: 765 x 610 mm (extra-large 2,000 x 610 mm available by customization and multi-stage mode)
TR7700QC SII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB thickness: 0.6–5 mm
Max PCB weight: typically 3 kg (optional 5 kg; some variants up to 12 kg)
Top clearance: 50 mm; Bottom clearance: 40 mm; Edge clearance: 3 mm (optional 4 / 5 mm)
Conveyor inline height: 880–920 mm (optional 940–965 mm SMEMA compatible)

Inspection functions

• Component defects: Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component
• Solder defects: Fillet height, Solder volume %, Excess solder, Insufficient solder, Bridging, Through‑hole pins, Lifted lead, Golden finger scratch/contamination

Dimensions & weight (by model)
WxDxH:
TR7700QC SII: 1100 x 1720 x 1710 mm
TR7700MQC SII: 1250 x 1740 x 1710 mm
TR7700L QC SII: 1365 x 1720 x 1710 mm
TR7700QC SII DL: 1100 x 1820 x 1710 mm
Note: signal tower height (515 mm) not included
Weight:
TR7700QC SII: 910 kg
TR7700MQC SII: 992 kg
TR7700L QC SII: 1025 kg
TR7700QC SII DL: 960 kg

Additional notes
Factory imaging resolutions: 10 µm / 12 µm / 15 µm. Quad digital fringe projectors for 3D measurements and multi-phase true color LED lighting. Supports IPC‑610 flexible algorithm programming and Smart Factory integration.

Technical specifications

• Model: TR7700QC SII
• Imaging method: Stop-and-Go
• Top camera: 12 MP high-speed camera
• Imaging resolutions (factory): 10 µm, 12 µm, 15 µm
• Lighting: Multi-phase True Color LED
• 3D technology: Quad digital fringe projectors
• Max 3D range (tall component inspection): 40 mm
• Imaging speed: 25 / 37 / 57 cm²/s (10 / 12 / 15 µm respectively)
• Motion control: Ballscrew + AC servo with motion controller (X, Y, Z)
• X-Y axis resolution: 1 µm
• Max PCB size options: 510×460 mm; 660×690 mm; 765×610 mm; DL lane configurations as described above
• PCB thickness: 0.6–5 mm
• Max PCB weight: typically 3 kg (optional 5 kg; some variants up to 12 kg)
• Clearances: Top 50 mm; Bottom 40 mm; Edge 3 mm (optional 4 / 5 mm)
• Conveyor inline height: 880–920 mm (optional 940–965 mm SMEMA compatible)
• Dimensions and weight per model: see table above
• Detected component defects and solder defects: see inspection functions