Optical inspection system TR7700QH SII

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Introduction
The TR7700QH SII Series is an ultra-high-speed 3D Automated Optical Inspection (AOI) system capable of inspecting at up to 80 cm²/sec while maintaining metrology-grade gauge R&R. It integrates Smart Programming, AI algorithms and precise metrology measurements. The platform supports Smart Factory standards including IPC-CFX and IPC-HERMES (IPC-HERMES-9852).

Features

• Ultra-high-speed camera: up to 80 cm²/sec
• Metrology-grade measurements
• AI-powered algorithms with Smart Programming
• Industry 4.0 ready: IPC-CFX and IPC-HERMES support

Optical System
Imaging method: Stop-and-Go
Top camera: 12 MP / 21 MP high-speed camera
Angle camera: N/A
Imaging resolution: 12 µm, 15 µm, 18 µm (factory settings). 18 µm available for TR7700QH SII; 12 µm available for TR7700QH SII & TR7700QH SII DL
Lighting: Multi-phase True Color LED
3D technology: Quad digital fringe projectors
Max. 3D range: 40 mm

Inspection Performance
Imaging speed: 12 MP @ 18 µm: 70 cm²/sec; 21 MP @ 12 µm: 60 cm²/sec; 21 MP @ 15 µm: 80 cm²/sec

Motion Table & Control
X-axis control: Ballscrew + AC servo with motion controller
Y-axis control: Ballscrew + AC servo with motion controller
Z-axis control: Ballscrew + AC servo with motion controller
X-Y axis resolution: 1 µm

Board Handling
Max PCB size: TR7700QH SII: 510 x 510 mm; TR7700QH SII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane; TR7700L QH SII: 765 x 610 mm
PCB thickness: 0.5 - 6 mm
Max PCB weight: TR7700QH SII (DL): 3 kg (optional: 5 kg); TR7700L QH SII: 3 kg (optional: 5 kg / 12 kg)
Top clearance: 50 mm
Bottom clearance: 40 mm
Edge clearance: TR7700QH SII (DL): 3 mm (optional: 4 mm / 5 mm); TR7700L QH SII: 3 mm (optional: 5 mm)
Conveyor / inline height: 880 – 920 mm (optional: 925–965 mm). SMEMA compatible

Inspection Functions
Component checks: Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong marking (OCV), Defective, Upside down, Extra component, Foreign material, Lifted component
Solder checks: Solder fillet height, Solder volume %, Excess solder, Insufficient solder, Bridging, Through-hole pins, Lifted lead, Golden finger scratch/contamination

Dimensions
WxDxH: TR7700QH SII: 1100 x 1730 x 1700 mm; TR7700QH SII DL: 1100 x 2005 x 1700 mm; TR7700L QH SII: 1365 x 1865 x 1700 mm (signal tower not included; signal tower height 520 mm)
Weight: TR7700QH SII: 920 kg; TR7700QH SII DL: 1020 kg; TR7700L QH SII: 1035 kg

Technical specifications

• Imaging method: Stop-and-Go
• Top camera: 12 MP / 21 MP high-speed camera
• Imaging resolution (factory settings): 12 µm, 15 µm, 18 µm (availability by sub-model)
• Lighting: Multi-phase True Color LED
• 3D technology: Quad digital fringe projectors
• Max. 3D range: 40 mm
• Imaging speed: up to 80 cm²/sec depending on camera/resolution
• Motion: Ballscrew + AC servo with motion controller (X/Y/Z)
• X-Y axis resolution: 1 µm
• Max PCB size and configurations: see Board Handling block above
• PCB thickness range: 0.5 - 6 mm
• Conveyor height (inline): 880 – 920 mm (optional 925–965 mm); SMEMA compatible